JPS5621350B2 - - Google Patents
Info
- Publication number
- JPS5621350B2 JPS5621350B2 JP5075778A JP5075778A JPS5621350B2 JP S5621350 B2 JPS5621350 B2 JP S5621350B2 JP 5075778 A JP5075778 A JP 5075778A JP 5075778 A JP5075778 A JP 5075778A JP S5621350 B2 JPS5621350 B2 JP S5621350B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5075778A JPS54143780A (en) | 1978-05-01 | 1978-05-01 | Manufacture of semiconductor sputtering target |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5075778A JPS54143780A (en) | 1978-05-01 | 1978-05-01 | Manufacture of semiconductor sputtering target |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54143780A JPS54143780A (en) | 1979-11-09 |
JPS5621350B2 true JPS5621350B2 (ja) | 1981-05-19 |
Family
ID=12867704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5075778A Granted JPS54143780A (en) | 1978-05-01 | 1978-05-01 | Manufacture of semiconductor sputtering target |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54143780A (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56134730A (en) * | 1980-03-25 | 1981-10-21 | Seiji Miyake | Production of thin film by sputtering |
JPS56134729A (en) * | 1980-03-25 | 1981-10-21 | Seiji Miyake | Production of thin film by sputtering |
JPH0745562Y2 (ja) * | 1988-05-06 | 1995-10-18 | 富士電機株式会社 | スパッタリング装置 |
US20060006064A1 (en) * | 2004-07-09 | 2006-01-12 | Avi Tepman | Target tiles in a staggered array |
US7550066B2 (en) | 2004-07-09 | 2009-06-23 | Applied Materials, Inc. | Staggered target tiles |
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1978
- 1978-05-01 JP JP5075778A patent/JPS54143780A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS54143780A (en) | 1979-11-09 |