JPS5619682A - Optical semiconductor device - Google Patents

Optical semiconductor device

Info

Publication number
JPS5619682A
JPS5619682A JP9532879A JP9532879A JPS5619682A JP S5619682 A JPS5619682 A JP S5619682A JP 9532879 A JP9532879 A JP 9532879A JP 9532879 A JP9532879 A JP 9532879A JP S5619682 A JPS5619682 A JP S5619682A
Authority
JP
Japan
Prior art keywords
heat sink
light receiving
receiving element
groove
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9532879A
Other languages
Japanese (ja)
Inventor
Takao Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9532879A priority Critical patent/JPS5619682A/en
Publication of JPS5619682A publication Critical patent/JPS5619682A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

PURPOSE:To obtain high response characteristics by employing a semiconductor substrate on which a light receiving element is provided as a heat sink, providing a groove which passes the central portion of the light receiving element, embedding an optical fiber in the groove, and arranging a light emitting element on the heat sink so as to oppose said fiber. CONSTITUTION:A light receiving element 3 is formed on an N-type Si substrate. The substrate is used as a heat sink. A V-shaped groove 6 which passes the central portion of the light receiving element 3 is provided in the surface of the heat sink. Then, an optical fiber 1 is embedded in said groove 6. A light emitting element 2 is fixed on the heat sink 5 so as to oppose one end of said optical fiber 1. Thereafter, the heat sink 5 is fixed to a stem 7 which serves as a common electrode. The electrodes of elements 2 and 3 are connected to leads 8 and 10 provided on both sides of the heat sink 5 via insulators 12 and 13, respectively, by using thin wires 9 and 11. In this constitution, the configuration of the device becomes compact, and the cost is reduced.
JP9532879A 1979-07-26 1979-07-26 Optical semiconductor device Pending JPS5619682A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9532879A JPS5619682A (en) 1979-07-26 1979-07-26 Optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9532879A JPS5619682A (en) 1979-07-26 1979-07-26 Optical semiconductor device

Publications (1)

Publication Number Publication Date
JPS5619682A true JPS5619682A (en) 1981-02-24

Family

ID=14134652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9532879A Pending JPS5619682A (en) 1979-07-26 1979-07-26 Optical semiconductor device

Country Status (1)

Country Link
JP (1) JPS5619682A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6868217B1 (en) * 2000-07-31 2005-03-15 Cisco Technology, Inc. Long reach unamplified optical SONET/SDH card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6868217B1 (en) * 2000-07-31 2005-03-15 Cisco Technology, Inc. Long reach unamplified optical SONET/SDH card

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