JPS5618077B2 - - Google Patents

Info

Publication number
JPS5618077B2
JPS5618077B2 JP14838575A JP14838575A JPS5618077B2 JP S5618077 B2 JPS5618077 B2 JP S5618077B2 JP 14838575 A JP14838575 A JP 14838575A JP 14838575 A JP14838575 A JP 14838575A JP S5618077 B2 JPS5618077 B2 JP S5618077B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14838575A
Other languages
Japanese (ja)
Other versions
JPS5272342A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14838575A priority Critical patent/JPS5272342A/ja
Publication of JPS5272342A publication Critical patent/JPS5272342A/ja
Publication of JPS5618077B2 publication Critical patent/JPS5618077B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP14838575A 1975-12-15 1975-12-15 Surface treating agent for copper Granted JPS5272342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14838575A JPS5272342A (en) 1975-12-15 1975-12-15 Surface treating agent for copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14838575A JPS5272342A (en) 1975-12-15 1975-12-15 Surface treating agent for copper

Publications (2)

Publication Number Publication Date
JPS5272342A JPS5272342A (en) 1977-06-16
JPS5618077B2 true JPS5618077B2 (index.php) 1981-04-25

Family

ID=15451572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14838575A Granted JPS5272342A (en) 1975-12-15 1975-12-15 Surface treating agent for copper

Country Status (1)

Country Link
JP (1) JPS5272342A (index.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017128800A (ja) * 2015-12-29 2017-07-27 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 銅表面上に有機被膜を形成するための方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6257795A (ja) * 1985-09-04 1987-03-13 Electroplating Eng Of Japan Co 水溶性フラツクス
JPS632397A (ja) * 1986-06-23 1988-01-07 株式会社日立製作所 プリント配線板の製造方法
CN1034820C (zh) * 1994-12-01 1997-05-07 西安交通大学 电解电容器阳极铝箔的腐蚀工艺
JP3205927B2 (ja) * 1997-04-07 2001-09-04 株式会社三和研究所 銅金共存基板の表面保護剤および表面保護膜の形成方法。
JP5351830B2 (ja) 2010-05-21 2013-11-27 日東電工株式会社 配線回路基板およびその製造方法
JP6012393B2 (ja) * 2012-10-23 2016-10-25 四国化成工業株式会社 銅の表面処理剤および表面処理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3761047A (en) * 1971-08-09 1973-09-25 Gould Inc Mold coating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017128800A (ja) * 2015-12-29 2017-07-27 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 銅表面上に有機被膜を形成するための方法

Also Published As

Publication number Publication date
JPS5272342A (en) 1977-06-16

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