JPS5617028A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5617028A JPS5617028A JP9155179A JP9155179A JPS5617028A JP S5617028 A JPS5617028 A JP S5617028A JP 9155179 A JP9155179 A JP 9155179A JP 9155179 A JP9155179 A JP 9155179A JP S5617028 A JPS5617028 A JP S5617028A
- Authority
- JP
- Japan
- Prior art keywords
- works
- contrive
- sorter
- feed
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000005520 cutting process Methods 0.000 abstract 2
- 238000004140 cleaning Methods 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9155179A JPS5617028A (en) | 1979-07-20 | 1979-07-20 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9155179A JPS5617028A (en) | 1979-07-20 | 1979-07-20 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5617028A true JPS5617028A (en) | 1981-02-18 |
| JPS6262461B2 JPS6262461B2 (enrdf_load_stackoverflow) | 1987-12-26 |
Family
ID=14029626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9155179A Granted JPS5617028A (en) | 1979-07-20 | 1979-07-20 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5617028A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60142249A (ja) * | 1983-12-28 | 1985-07-27 | Kobe Steel Ltd | 超音波探傷における表面エコ−ゲ−ト法 |
| JPS61147543A (ja) * | 1984-12-21 | 1986-07-05 | Hitachi Electronics Eng Co Ltd | 電子部品選別押印装置 |
| JPH02133337U (enrdf_load_stackoverflow) * | 1989-04-10 | 1990-11-06 | ||
| US8056253B2 (en) * | 2006-01-18 | 2011-11-15 | Akrion Systems Llc | Systems and methods for drying a rotating substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4739633A (en) * | 1985-11-12 | 1988-04-26 | Hypres, Inc. | Room temperature to cryogenic electrical interface |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52167A (en) * | 1975-06-23 | 1977-01-05 | Hitachi Ltd | Method of marking semiconductor |
-
1979
- 1979-07-20 JP JP9155179A patent/JPS5617028A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52167A (en) * | 1975-06-23 | 1977-01-05 | Hitachi Ltd | Method of marking semiconductor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60142249A (ja) * | 1983-12-28 | 1985-07-27 | Kobe Steel Ltd | 超音波探傷における表面エコ−ゲ−ト法 |
| JPS61147543A (ja) * | 1984-12-21 | 1986-07-05 | Hitachi Electronics Eng Co Ltd | 電子部品選別押印装置 |
| JPH02133337U (enrdf_load_stackoverflow) * | 1989-04-10 | 1990-11-06 | ||
| US8056253B2 (en) * | 2006-01-18 | 2011-11-15 | Akrion Systems Llc | Systems and methods for drying a rotating substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6262461B2 (enrdf_load_stackoverflow) | 1987-12-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104822230B (zh) | 一种多功能pcb板生产自动化系统 | |
| CN106862932B (zh) | 一种电机壳的开孔研磨自动化一体机 | |
| CN206437495U (zh) | 硒鼓海绵及刮片自动安装生产线 | |
| CN114367603B (zh) | 一种高效可调的二极管裁脚设备 | |
| JPS5617028A (en) | Manufacture of semiconductor device | |
| US2405074A (en) | Method and machine for assembling articles | |
| KR20160071340A (ko) | 전자부품용 핀 자동 삽입장치 | |
| CN207985898U (zh) | 一种柔性化自动上料机构 | |
| CN215356738U (zh) | 一种激光打标设备 | |
| CN214137812U (zh) | 一种旋转式的灯罩移印装置 | |
| CN214023713U (zh) | 一种剪板装置 | |
| US2682344A (en) | Mechanism for stacking sheet material | |
| CN208761533U (zh) | 一种料盒全自动回收生产线 | |
| CN210943813U (zh) | 一种平板模条自动供料机构 | |
| CN207207262U (zh) | 一种蜂窝纸板印刷开槽一体机 | |
| JPS5623327A (en) | Press equipment with die pool | |
| CN213264382U (zh) | 激光打码上下料装置 | |
| CN208478294U (zh) | 一种芯片散热器粘贴机构 | |
| CN210235787U (zh) | 一种用于化妆品粉料自动上粉机 | |
| CN222236731U (zh) | 一种自动包棉设备 | |
| EP0349852A3 (en) | Method for the automatic feed of combing machines | |
| CN223432959U (en) | Alloy resistor granulator | |
| CN109623170A (zh) | 一种全自动sd卡切割装置 | |
| CN217198863U (zh) | 一种印刷品用打包装置 | |
| FR2291126A1 (fr) | Procede d'acheminement de barres |