JPS5617028A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5617028A
JPS5617028A JP9155179A JP9155179A JPS5617028A JP S5617028 A JPS5617028 A JP S5617028A JP 9155179 A JP9155179 A JP 9155179A JP 9155179 A JP9155179 A JP 9155179A JP S5617028 A JPS5617028 A JP S5617028A
Authority
JP
Japan
Prior art keywords
works
contrive
sorter
feed
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9155179A
Other languages
Japanese (ja)
Other versions
JPS6262461B2 (en
Inventor
Hiroshi Takao
Yuji Ikeda
Toshio Hoshino
Takatoshi Hagiwara
Seiichi Takei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9155179A priority Critical patent/JPS5617028A/en
Publication of JPS5617028A publication Critical patent/JPS5617028A/en
Publication of JPS6262461B2 publication Critical patent/JPS6262461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To contrive the continuation of works, to improve the yield of manufacturing a semiconductor device and contrive the reduction of the number of working personnel concerned by coupling charging, transferring, marking, lead cutting and forming, and characteristic selecting units. CONSTITUTION:A magazine 24 filled with works coupled by a lead frame is mounted on a bench 22, and an operation is started. A weight 31 presses the works 32 to operate a supporting rod 29 and a pushing plate 34 so as to feed the works one by one, and to intermittently transfer and feed the works between the respective units by the actions of pawls 43 and the members 41 by a feeding machanism 20. A cleaning unit first cleans the printed surfaces of the works via rotating belt immersed with organic solvent, a making unit roll prints ultravoilet ray curable ink on the works, and ultraviolet ray lamps dry them. Subsequently, the works reach a cutting and forming unit 16, which cuts the burrs of the works, and dies 77, 79 cut the frame of the works, and forming unit 87 forms lead wires 6 at the works. Then, the works are pneumatically conveyed, are partly stored temporarily, and are fed to a sorter 18. The sorter 18 elevationally moves its body 100 up and down to insert the works into sockets 107 to measure and sort the works. The works are then sequentially fed through a passage 101. This configuration can efficiently and automatically process the works thoroughly and consistently.
JP9155179A 1979-07-20 1979-07-20 Manufacture of semiconductor device Granted JPS5617028A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9155179A JPS5617028A (en) 1979-07-20 1979-07-20 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9155179A JPS5617028A (en) 1979-07-20 1979-07-20 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5617028A true JPS5617028A (en) 1981-02-18
JPS6262461B2 JPS6262461B2 (en) 1987-12-26

Family

ID=14029626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9155179A Granted JPS5617028A (en) 1979-07-20 1979-07-20 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5617028A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142249A (en) * 1983-12-28 1985-07-27 Kobe Steel Ltd Surface echo gate method in ultrasonic flaw detection
JPS61147543A (en) * 1984-12-21 1986-07-05 Hitachi Electronics Eng Co Ltd Electronic part sorting and sealing device
JPH02133337U (en) * 1989-04-10 1990-11-06
US8056253B2 (en) * 2006-01-18 2011-11-15 Akrion Systems Llc Systems and methods for drying a rotating substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4739633A (en) * 1985-11-12 1988-04-26 Hypres, Inc. Room temperature to cryogenic electrical interface

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52167A (en) * 1975-06-23 1977-01-05 Hitachi Ltd Method of marking semiconductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52167A (en) * 1975-06-23 1977-01-05 Hitachi Ltd Method of marking semiconductor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142249A (en) * 1983-12-28 1985-07-27 Kobe Steel Ltd Surface echo gate method in ultrasonic flaw detection
JPS61147543A (en) * 1984-12-21 1986-07-05 Hitachi Electronics Eng Co Ltd Electronic part sorting and sealing device
JPH02133337U (en) * 1989-04-10 1990-11-06
US8056253B2 (en) * 2006-01-18 2011-11-15 Akrion Systems Llc Systems and methods for drying a rotating substrate

Also Published As

Publication number Publication date
JPS6262461B2 (en) 1987-12-26

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