JPS56169342A - Bonding wire for semiconductor element - Google Patents

Bonding wire for semiconductor element

Info

Publication number
JPS56169342A
JPS56169342A JP7362280A JP7362280A JPS56169342A JP S56169342 A JPS56169342 A JP S56169342A JP 7362280 A JP7362280 A JP 7362280A JP 7362280 A JP7362280 A JP 7362280A JP S56169342 A JPS56169342 A JP S56169342A
Authority
JP
Japan
Prior art keywords
purity
bonding wire
semiconductor element
bonding property
obstruct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7362280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6243541B2 (esLanguage
Inventor
Norimasa Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP7362280A priority Critical patent/JPS56169342A/ja
Publication of JPS56169342A publication Critical patent/JPS56169342A/ja
Publication of JPS6243541B2 publication Critical patent/JPS6243541B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/552—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
JP7362280A 1980-05-31 1980-05-31 Bonding wire for semiconductor element Granted JPS56169342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7362280A JPS56169342A (en) 1980-05-31 1980-05-31 Bonding wire for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7362280A JPS56169342A (en) 1980-05-31 1980-05-31 Bonding wire for semiconductor element

Publications (2)

Publication Number Publication Date
JPS56169342A true JPS56169342A (en) 1981-12-26
JPS6243541B2 JPS6243541B2 (esLanguage) 1987-09-14

Family

ID=13523596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7362280A Granted JPS56169342A (en) 1980-05-31 1980-05-31 Bonding wire for semiconductor element

Country Status (1)

Country Link
JP (1) JPS56169342A (esLanguage)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201454A (ja) * 1983-04-28 1984-11-15 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｐｄ細線

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424265A (en) * 1977-07-27 1979-02-23 Shii Bii Esu Yuugen Method of forming prefabbreinforcinggiron cage

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424265A (en) * 1977-07-27 1979-02-23 Shii Bii Esu Yuugen Method of forming prefabbreinforcinggiron cage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201454A (ja) * 1983-04-28 1984-11-15 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｐｄ細線

Also Published As

Publication number Publication date
JPS6243541B2 (esLanguage) 1987-09-14

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