JPS56161648A - Heating block for pellet fitting device - Google Patents

Heating block for pellet fitting device

Info

Publication number
JPS56161648A
JPS56161648A JP6411780A JP6411780A JPS56161648A JP S56161648 A JPS56161648 A JP S56161648A JP 6411780 A JP6411780 A JP 6411780A JP 6411780 A JP6411780 A JP 6411780A JP S56161648 A JPS56161648 A JP S56161648A
Authority
JP
Japan
Prior art keywords
width
pellet
grooves
package
measure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6411780A
Other languages
English (en)
Japanese (ja)
Other versions
JPH024142B2 (enrdf_load_stackoverflow
Inventor
Toshikazu Oshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6411780A priority Critical patent/JPS56161648A/ja
Publication of JPS56161648A publication Critical patent/JPS56161648A/ja
Publication of JPH024142B2 publication Critical patent/JPH024142B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP6411780A 1980-05-16 1980-05-16 Heating block for pellet fitting device Granted JPS56161648A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6411780A JPS56161648A (en) 1980-05-16 1980-05-16 Heating block for pellet fitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6411780A JPS56161648A (en) 1980-05-16 1980-05-16 Heating block for pellet fitting device

Publications (2)

Publication Number Publication Date
JPS56161648A true JPS56161648A (en) 1981-12-12
JPH024142B2 JPH024142B2 (enrdf_load_stackoverflow) 1990-01-26

Family

ID=13248796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6411780A Granted JPS56161648A (en) 1980-05-16 1980-05-16 Heating block for pellet fitting device

Country Status (1)

Country Link
JP (1) JPS56161648A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6172844U (enrdf_load_stackoverflow) * 1984-10-18 1986-05-17
JPS61176126A (ja) * 1985-01-31 1986-08-07 Nec Corp ダイボンデイング装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54768U (enrdf_load_stackoverflow) * 1977-06-06 1979-01-06
JPS5527619A (en) * 1978-08-17 1980-02-27 Mitsubishi Electric Corp Die bonding device
JPS5548938A (en) * 1978-10-05 1980-04-08 Toshiba Corp Manufacturing of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54768U (enrdf_load_stackoverflow) * 1977-06-06 1979-01-06
JPS5527619A (en) * 1978-08-17 1980-02-27 Mitsubishi Electric Corp Die bonding device
JPS5548938A (en) * 1978-10-05 1980-04-08 Toshiba Corp Manufacturing of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6172844U (enrdf_load_stackoverflow) * 1984-10-18 1986-05-17
JPS61176126A (ja) * 1985-01-31 1986-08-07 Nec Corp ダイボンデイング装置

Also Published As

Publication number Publication date
JPH024142B2 (enrdf_load_stackoverflow) 1990-01-26

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