JPS56161461A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS56161461A JPS56161461A JP6390880A JP6390880A JPS56161461A JP S56161461 A JPS56161461 A JP S56161461A JP 6390880 A JP6390880 A JP 6390880A JP 6390880 A JP6390880 A JP 6390880A JP S56161461 A JPS56161461 A JP S56161461A
- Authority
- JP
- Japan
- Prior art keywords
- sic
- beo
- heat conductivity
- resin
- contg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: A resin composition with excellent heat conductivity, electrical insulation and processability, which is prepared by dispersing and mixing a powder consisting of a sintered material primarily composed of SiC, contg. at least one of BeO and Si3N4.
CONSTITUTION: A powder consisting of a sintered material primarily composed of SiC, contg. BeO and/or Si3O4, is mixed with a resin primarily consisting of a silicone or epoxy resin. Since SiC has good insulation of specific resistance ≥1010Ωcm and excellent heat conductivity of 0.7cal/cm.°C.sec, for example, a composition consisting of 100pts.wt. SiC and 2pts.wt. or more BeO and/or Si3O4, presents exceedingly enhanced heat conductivity as compared with each resin alone without failure of electrical insulation to any extent.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6390880A JPS56161461A (en) | 1980-05-16 | 1980-05-16 | Resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6390880A JPS56161461A (en) | 1980-05-16 | 1980-05-16 | Resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56161461A true JPS56161461A (en) | 1981-12-11 |
Family
ID=13242892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6390880A Pending JPS56161461A (en) | 1980-05-16 | 1980-05-16 | Resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56161461A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4584336A (en) * | 1984-10-29 | 1986-04-22 | Sws Silicones Corporation | Thermally conductive room temperature vulcanizable compositions |
US4585822A (en) * | 1984-10-29 | 1986-04-29 | Sws Silicones Corporation | Thermally conductive room temperature vulcanizable compositions |
US4588768A (en) * | 1984-10-29 | 1986-05-13 | Sws Silicones Corporation | Thermally conductive heat curable organopolysiloxane compositions |
EP0183056A2 (en) * | 1984-10-29 | 1986-06-04 | Wacker Silicones Corporation | Thermally conductive room temperature vulcanizable compositions |
EP0283319A2 (en) * | 1987-03-19 | 1988-09-21 | The Dexter Corporation | Encapsulating electronic components |
US4783501A (en) * | 1985-08-29 | 1988-11-08 | Mitsubishi Rayon Co., Ltd. | Method for preparing a polymeric composition |
US5158735A (en) * | 1987-03-19 | 1992-10-27 | The Dexter Corporation | Encapsulating electronic components |
-
1980
- 1980-05-16 JP JP6390880A patent/JPS56161461A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4584336A (en) * | 1984-10-29 | 1986-04-22 | Sws Silicones Corporation | Thermally conductive room temperature vulcanizable compositions |
US4585822A (en) * | 1984-10-29 | 1986-04-29 | Sws Silicones Corporation | Thermally conductive room temperature vulcanizable compositions |
US4588768A (en) * | 1984-10-29 | 1986-05-13 | Sws Silicones Corporation | Thermally conductive heat curable organopolysiloxane compositions |
EP0183056A2 (en) * | 1984-10-29 | 1986-06-04 | Wacker Silicones Corporation | Thermally conductive room temperature vulcanizable compositions |
US4783501A (en) * | 1985-08-29 | 1988-11-08 | Mitsubishi Rayon Co., Ltd. | Method for preparing a polymeric composition |
US4910251A (en) * | 1985-08-29 | 1990-03-20 | Mitsubishi Rayon Co., Ltd. | Method for preparing a polymeric composition |
EP0283319A2 (en) * | 1987-03-19 | 1988-09-21 | The Dexter Corporation | Encapsulating electronic components |
US5158735A (en) * | 1987-03-19 | 1992-10-27 | The Dexter Corporation | Encapsulating electronic components |
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