JPS56161461A - Resin composition - Google Patents

Resin composition

Info

Publication number
JPS56161461A
JPS56161461A JP6390880A JP6390880A JPS56161461A JP S56161461 A JPS56161461 A JP S56161461A JP 6390880 A JP6390880 A JP 6390880A JP 6390880 A JP6390880 A JP 6390880A JP S56161461 A JPS56161461 A JP S56161461A
Authority
JP
Japan
Prior art keywords
sic
beo
heat conductivity
resin
contg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6390880A
Other languages
Japanese (ja)
Inventor
Yasutoshi Kurihara
Komei Yatsuno
Kosuke Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6390880A priority Critical patent/JPS56161461A/en
Publication of JPS56161461A publication Critical patent/JPS56161461A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: A resin composition with excellent heat conductivity, electrical insulation and processability, which is prepared by dispersing and mixing a powder consisting of a sintered material primarily composed of SiC, contg. at least one of BeO and Si3N4.
CONSTITUTION: A powder consisting of a sintered material primarily composed of SiC, contg. BeO and/or Si3O4, is mixed with a resin primarily consisting of a silicone or epoxy resin. Since SiC has good insulation of specific resistance ≥1010Ωcm and excellent heat conductivity of 0.7cal/cm.°C.sec, for example, a composition consisting of 100pts.wt. SiC and 2pts.wt. or more BeO and/or Si3O4, presents exceedingly enhanced heat conductivity as compared with each resin alone without failure of electrical insulation to any extent.
COPYRIGHT: (C)1981,JPO&Japio
JP6390880A 1980-05-16 1980-05-16 Resin composition Pending JPS56161461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6390880A JPS56161461A (en) 1980-05-16 1980-05-16 Resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6390880A JPS56161461A (en) 1980-05-16 1980-05-16 Resin composition

Publications (1)

Publication Number Publication Date
JPS56161461A true JPS56161461A (en) 1981-12-11

Family

ID=13242892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6390880A Pending JPS56161461A (en) 1980-05-16 1980-05-16 Resin composition

Country Status (1)

Country Link
JP (1) JPS56161461A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584336A (en) * 1984-10-29 1986-04-22 Sws Silicones Corporation Thermally conductive room temperature vulcanizable compositions
US4585822A (en) * 1984-10-29 1986-04-29 Sws Silicones Corporation Thermally conductive room temperature vulcanizable compositions
US4588768A (en) * 1984-10-29 1986-05-13 Sws Silicones Corporation Thermally conductive heat curable organopolysiloxane compositions
EP0183056A2 (en) * 1984-10-29 1986-06-04 Wacker Silicones Corporation Thermally conductive room temperature vulcanizable compositions
EP0283319A2 (en) * 1987-03-19 1988-09-21 The Dexter Corporation Encapsulating electronic components
US4783501A (en) * 1985-08-29 1988-11-08 Mitsubishi Rayon Co., Ltd. Method for preparing a polymeric composition
US5158735A (en) * 1987-03-19 1992-10-27 The Dexter Corporation Encapsulating electronic components

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584336A (en) * 1984-10-29 1986-04-22 Sws Silicones Corporation Thermally conductive room temperature vulcanizable compositions
US4585822A (en) * 1984-10-29 1986-04-29 Sws Silicones Corporation Thermally conductive room temperature vulcanizable compositions
US4588768A (en) * 1984-10-29 1986-05-13 Sws Silicones Corporation Thermally conductive heat curable organopolysiloxane compositions
EP0183056A2 (en) * 1984-10-29 1986-06-04 Wacker Silicones Corporation Thermally conductive room temperature vulcanizable compositions
US4783501A (en) * 1985-08-29 1988-11-08 Mitsubishi Rayon Co., Ltd. Method for preparing a polymeric composition
US4910251A (en) * 1985-08-29 1990-03-20 Mitsubishi Rayon Co., Ltd. Method for preparing a polymeric composition
EP0283319A2 (en) * 1987-03-19 1988-09-21 The Dexter Corporation Encapsulating electronic components
US5158735A (en) * 1987-03-19 1992-10-27 The Dexter Corporation Encapsulating electronic components

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