JPS56158458A - Sealing of electronic parts - Google Patents

Sealing of electronic parts

Info

Publication number
JPS56158458A
JPS56158458A JP6186280A JP6186280A JPS56158458A JP S56158458 A JPS56158458 A JP S56158458A JP 6186280 A JP6186280 A JP 6186280A JP 6186280 A JP6186280 A JP 6186280A JP S56158458 A JPS56158458 A JP S56158458A
Authority
JP
Japan
Prior art keywords
substrate
sealing
metalized
parts
copal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6186280A
Other languages
English (en)
Other versions
JPS5949698B2 (ja
Inventor
Kazufumi Ogawa
Taketoshi Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6186280A priority Critical patent/JPS5949698B2/ja
Publication of JPS56158458A publication Critical patent/JPS56158458A/ja
Publication of JPS5949698B2 publication Critical patent/JPS5949698B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP6186280A 1980-05-09 1980-05-09 電子部品の封止方法 Expired JPS5949698B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6186280A JPS5949698B2 (ja) 1980-05-09 1980-05-09 電子部品の封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6186280A JPS5949698B2 (ja) 1980-05-09 1980-05-09 電子部品の封止方法

Publications (2)

Publication Number Publication Date
JPS56158458A true JPS56158458A (en) 1981-12-07
JPS5949698B2 JPS5949698B2 (ja) 1984-12-04

Family

ID=13183340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6186280A Expired JPS5949698B2 (ja) 1980-05-09 1980-05-09 電子部品の封止方法

Country Status (1)

Country Link
JP (1) JPS5949698B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517738A (en) * 1982-04-24 1985-05-21 Tokyo Shibaura Denki Kabushiki Kaisha Method for packaging electronic parts
US4685200A (en) * 1982-01-18 1987-08-11 Analog Devices, Incorporated Low internal temperature technique for hermetic sealing of microelectronic enclosures

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3633346B1 (en) 2017-05-25 2023-09-20 Shin-Etsu Chemical Co., Ltd. Method for analyzing degree of hydrophobicity of powder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4685200A (en) * 1982-01-18 1987-08-11 Analog Devices, Incorporated Low internal temperature technique for hermetic sealing of microelectronic enclosures
US4517738A (en) * 1982-04-24 1985-05-21 Tokyo Shibaura Denki Kabushiki Kaisha Method for packaging electronic parts

Also Published As

Publication number Publication date
JPS5949698B2 (ja) 1984-12-04

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