JPS56158441A - Wire bonding and device thereof - Google Patents

Wire bonding and device thereof

Info

Publication number
JPS56158441A
JPS56158441A JP6176780A JP6176780A JPS56158441A JP S56158441 A JPS56158441 A JP S56158441A JP 6176780 A JP6176780 A JP 6176780A JP 6176780 A JP6176780 A JP 6176780A JP S56158441 A JPS56158441 A JP S56158441A
Authority
JP
Japan
Prior art keywords
lead
wire bonding
control unit
height
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6176780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6246979B2 (enExample
Inventor
Yuzo Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6176780A priority Critical patent/JPS56158441A/ja
Publication of JPS56158441A publication Critical patent/JPS56158441A/ja
Publication of JPS6246979B2 publication Critical patent/JPS6246979B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP6176780A 1980-05-12 1980-05-12 Wire bonding and device thereof Granted JPS56158441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6176780A JPS56158441A (en) 1980-05-12 1980-05-12 Wire bonding and device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6176780A JPS56158441A (en) 1980-05-12 1980-05-12 Wire bonding and device thereof

Publications (2)

Publication Number Publication Date
JPS56158441A true JPS56158441A (en) 1981-12-07
JPS6246979B2 JPS6246979B2 (enExample) 1987-10-06

Family

ID=13180592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6176780A Granted JPS56158441A (en) 1980-05-12 1980-05-12 Wire bonding and device thereof

Country Status (1)

Country Link
JP (1) JPS56158441A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183047A (en) * 1981-05-07 1982-11-11 Nec Corp Method for wire bonding and device thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183047A (en) * 1981-05-07 1982-11-11 Nec Corp Method for wire bonding and device thereof

Also Published As

Publication number Publication date
JPS6246979B2 (enExample) 1987-10-06

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