JPS56155539A - Device for transfer molding - Google Patents

Device for transfer molding

Info

Publication number
JPS56155539A
JPS56155539A JP2303181A JP2303181A JPS56155539A JP S56155539 A JPS56155539 A JP S56155539A JP 2303181 A JP2303181 A JP 2303181A JP 2303181 A JP2303181 A JP 2303181A JP S56155539 A JPS56155539 A JP S56155539A
Authority
JP
Japan
Prior art keywords
resin
pressure
detector
cavity
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2303181A
Other languages
Japanese (ja)
Inventor
Sumio Nishida
Susumu Okikawa
Yoshiaki Wakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2303181A priority Critical patent/JPS56155539A/en
Publication of JPS56155539A publication Critical patent/JPS56155539A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C2045/2722—Nozzles or runner channels provided with a pressure sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To control the implanting pressure of resin as well as to perform a hermetical sealing of the resin by a method wherein a pressure detector is installed in such manner that it is exposed at a section on the passage where the resin is pressure-feeded to the cavity on which the material to be formed is inserted. CONSTITUTION:In the device with which a forming and sealing work is performed on electronic parts and the like, the pressure detector 10 is installed at a section on the runner 4 with which the resin is guided to a cavity 5 through a pouring hole 3. A cavity 6 is installed at the end section of the detector 10 having a built-in sensor on an elastic container 7 and oil 8 filled in, and the detector 10 is installed at the lower section of the cavity 6 in such manner that the detector is in exposed state. Accordingly, the pressure of the implanted resin is detected and the implanting pressure can be controlled at a proper value by operating a controlling circuit 12 in accordance with the detected value. Through these procedures, the breakage of the wire and the like on the sealed element can be prevented and the resin sealing can be performed harmetically.
JP2303181A 1981-02-20 1981-02-20 Device for transfer molding Pending JPS56155539A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2303181A JPS56155539A (en) 1981-02-20 1981-02-20 Device for transfer molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2303181A JPS56155539A (en) 1981-02-20 1981-02-20 Device for transfer molding

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3678173A Division JPS49124154A (en) 1973-04-02 1973-04-02

Publications (1)

Publication Number Publication Date
JPS56155539A true JPS56155539A (en) 1981-12-01

Family

ID=12099097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2303181A Pending JPS56155539A (en) 1981-02-20 1981-02-20 Device for transfer molding

Country Status (1)

Country Link
JP (1) JPS56155539A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004014632A1 (en) * 2002-08-12 2004-02-19 Kemet Electronics Corporation Closed loop material pressure control for the encapsulation process of electronic components
JP2020062866A (en) * 2018-10-19 2020-04-23 内山工業株式会社 Quality determination method for molding quality of resin molded product

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004014632A1 (en) * 2002-08-12 2004-02-19 Kemet Electronics Corporation Closed loop material pressure control for the encapsulation process of electronic components
JP2020062866A (en) * 2018-10-19 2020-04-23 内山工業株式会社 Quality determination method for molding quality of resin molded product

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