JPS5615496B2 - - Google Patents
Info
- Publication number
- JPS5615496B2 JPS5615496B2 JP1995875A JP1995875A JPS5615496B2 JP S5615496 B2 JPS5615496 B2 JP S5615496B2 JP 1995875 A JP1995875 A JP 1995875A JP 1995875 A JP1995875 A JP 1995875A JP S5615496 B2 JPS5615496 B2 JP S5615496B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7402422A NL7402422A (nl) | 1974-02-22 | 1974-02-22 | Universele verkoperingsoplossing. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50119726A JPS50119726A (https=) | 1975-09-19 |
| JPS5615496B2 true JPS5615496B2 (https=) | 1981-04-10 |
Family
ID=19820810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1995875A Expired JPS5615496B2 (https=) | 1974-02-22 | 1975-02-19 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4248633A (https=) |
| JP (1) | JPS5615496B2 (https=) |
| BE (1) | BE825773A (https=) |
| CA (1) | CA1069367A (https=) |
| DE (1) | DE2505958C3 (https=) |
| FR (1) | FR2262123B1 (https=) |
| GB (1) | GB1490914A (https=) |
| NL (1) | NL7402422A (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USH325H (en) | 1980-07-30 | 1987-09-01 | Richardson Chemical Company | Electroless deposition of transition metals |
| US4450191A (en) * | 1982-09-02 | 1984-05-22 | Omi International Corporation | Ammonium ions used as electroless copper plating rate controller |
| US4563217A (en) * | 1983-07-25 | 1986-01-07 | Hitachi, Ltd. | Electroless copper plating solution |
| JPS6215235A (ja) * | 1985-07-15 | 1987-01-23 | Mitsubishi Rayon Co Ltd | 導電性高分子材料の製造法 |
| DE3622090C1 (https=) * | 1986-07-02 | 1990-02-15 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | |
| JPH04325688A (ja) * | 1991-04-26 | 1992-11-16 | Murata Mfg Co Ltd | 無電解めっき浴 |
| US5256441A (en) * | 1992-08-04 | 1993-10-26 | Amp-Akzo Corporation | Ductile copper |
| US5306336A (en) * | 1992-11-20 | 1994-04-26 | Monsanto Company | Sulfate-free electroless copper plating baths |
| MY144574A (en) * | 1998-09-14 | 2011-10-14 | Ibiden Co Ltd | Printed circuit board and method for its production |
| JP3444276B2 (ja) * | 2000-06-19 | 2003-09-08 | 株式会社村田製作所 | 無電解銅めっき浴、無電解銅めっき方法および電子部品 |
| WO2002063069A2 (en) * | 2001-01-12 | 2002-08-15 | University Of Rochester | Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
| JP4663243B2 (ja) * | 2004-01-13 | 2011-04-06 | 上村工業株式会社 | 無電解銅めっき浴 |
| TW200813255A (en) * | 2006-07-07 | 2008-03-16 | Rohm & Haas Elect Mat | Environmentally friendly electroless copper compositions |
| EP1876260B1 (en) * | 2006-07-07 | 2018-11-28 | Rohm and Haas Electronic Materials LLC | Improved electroless copper compositions |
| TWI347373B (en) * | 2006-07-07 | 2011-08-21 | Rohm & Haas Elect Mat | Formaldehyde free electroless copper compositions |
| TWI348499B (en) * | 2006-07-07 | 2011-09-11 | Rohm & Haas Elect Mat | Electroless copper and redox couples |
| TWI649449B (zh) * | 2015-11-27 | 2019-02-01 | 德國艾托特克公司 | 鈀之電鍍浴組合物及無電電鍍方法 |
| PL3184667T3 (pl) * | 2015-12-23 | 2020-05-18 | Uniwersytet Warszawski | Środki do prowadzenia bezprądowego osadzania metalu z precyzją submonowarstw atomowych |
| JP6821696B2 (ja) | 2015-12-23 | 2021-01-27 | ウニヘルシテット・ワルシャフスキＵｎｉｗｅｒｓｙｔｅｔ Ｗａｒｓｚａｗｓｋｉ | 準単原子層精度で無電解金属析出を行うための手段 |
| US20190382901A1 (en) * | 2018-06-15 | 2019-12-19 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions and methods for electroless plating copper on substrates |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1143021A (en) * | 1965-10-01 | 1969-02-19 | Itek Corp | Photographic metal salt transfer process |
| NL155055B (nl) | 1966-05-07 | 1977-11-15 | Philips Nv | Werkwijze voor het metalliseren van kiembeelden op elektrisch niet-geleidende dragers en dragers voorzien van aldus verkregen metaalbeelden. |
| US3663242A (en) * | 1970-09-25 | 1972-05-16 | Shipley Co | Stabilized electroless plating solutions |
-
1974
- 1974-02-22 NL NL7402422A patent/NL7402422A/xx not_active Application Discontinuation
-
1975
- 1975-02-13 DE DE2505958A patent/DE2505958C3/de not_active Expired
- 1975-02-19 CA CA220,417A patent/CA1069367A/en not_active Expired
- 1975-02-19 GB GB6992/75A patent/GB1490914A/en not_active Expired
- 1975-02-19 JP JP1995875A patent/JPS5615496B2/ja not_active Expired
- 1975-02-20 BE BE153558A patent/BE825773A/xx unknown
- 1975-02-21 FR FR7505441A patent/FR2262123B1/fr not_active Expired
-
1979
- 1979-07-23 US US06/059,797 patent/US4248633A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| FR2262123B1 (https=) | 1978-08-18 |
| DE2505958B2 (de) | 1981-08-06 |
| US4248633A (en) | 1981-02-03 |
| JPS50119726A (https=) | 1975-09-19 |
| BE825773A (fr) | 1975-08-20 |
| GB1490914A (en) | 1977-11-02 |
| DE2505958A1 (de) | 1975-08-28 |
| DE2505958C3 (de) | 1982-04-22 |
| CA1069367A (en) | 1980-01-08 |
| NL7402422A (nl) | 1975-08-26 |
| FR2262123A1 (https=) | 1975-09-19 |