JPS5615496B2 - - Google Patents

Info

Publication number
JPS5615496B2
JPS5615496B2 JP1995875A JP1995875A JPS5615496B2 JP S5615496 B2 JPS5615496 B2 JP S5615496B2 JP 1995875 A JP1995875 A JP 1995875A JP 1995875 A JP1995875 A JP 1995875A JP S5615496 B2 JPS5615496 B2 JP S5615496B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1995875A
Other languages
Japanese (ja)
Other versions
JPS50119726A (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50119726A publication Critical patent/JPS50119726A/ja
Publication of JPS5615496B2 publication Critical patent/JPS5615496B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP1995875A 1974-02-22 1975-02-19 Expired JPS5615496B2 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7402422A NL7402422A (nl) 1974-02-22 1974-02-22 Universele verkoperingsoplossing.

Publications (2)

Publication Number Publication Date
JPS50119726A JPS50119726A (fr) 1975-09-19
JPS5615496B2 true JPS5615496B2 (fr) 1981-04-10

Family

ID=19820810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1995875A Expired JPS5615496B2 (fr) 1974-02-22 1975-02-19

Country Status (8)

Country Link
US (1) US4248633A (fr)
JP (1) JPS5615496B2 (fr)
BE (1) BE825773A (fr)
CA (1) CA1069367A (fr)
DE (1) DE2505958C3 (fr)
FR (1) FR2262123B1 (fr)
GB (1) GB1490914A (fr)
NL (1) NL7402422A (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USH325H (en) 1980-07-30 1987-09-01 Richardson Chemical Company Electroless deposition of transition metals
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
EP0132594B1 (fr) * 1983-07-25 1988-09-07 Hitachi, Ltd. Solution de cuivre pour le placage sans courant
JPS6215235A (ja) * 1985-07-15 1987-01-23 Mitsubishi Rayon Co Ltd 導電性高分子材料の製造法
DE3622090C1 (fr) * 1986-07-02 1990-02-15 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
JPH04325688A (ja) * 1991-04-26 1992-11-16 Murata Mfg Co Ltd 無電解めっき浴
US5256441A (en) * 1992-08-04 1993-10-26 Amp-Akzo Corporation Ductile copper
US5306336A (en) * 1992-11-20 1994-04-26 Monsanto Company Sulfate-free electroless copper plating baths
MY144574A (en) * 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
JP3444276B2 (ja) * 2000-06-19 2003-09-08 株式会社村田製作所 無電解銅めっき浴、無電解銅めっき方法および電子部品
WO2002063069A2 (fr) * 2001-01-12 2002-08-15 University Of Rochester Procedes et systemes de depot electrolytique ou autocatalytique de metal dans des parties a rapport de forme eleve
JP4663243B2 (ja) * 2004-01-13 2011-04-06 上村工業株式会社 無電解銅めっき浴
TWI348499B (en) * 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
TWI347982B (en) * 2006-07-07 2011-09-01 Rohm & Haas Elect Mat Improved electroless copper compositions
EP1876262A1 (fr) * 2006-07-07 2008-01-09 Rohm and Haas Electronic Materials, L.L.C. Compositions de dépôt autocatalytique sans danger pour lýenvironnement
TWI347373B (en) * 2006-07-07 2011-08-21 Rohm & Haas Elect Mat Formaldehyde free electroless copper compositions
TWI649449B (zh) * 2015-11-27 2019-02-01 德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
WO2017109556A1 (fr) 2015-12-23 2017-06-29 Uniwersytet Warszawski Moyens de réalisation d'un dépôt de métal autocatalytique avec précision de monocouche secondaire atomique
PL3184667T3 (pl) * 2015-12-23 2020-05-18 Uniwersytet Warszawski Środki do prowadzenia bezprądowego osadzania metalu z precyzją submonowarstw atomowych
US20190382901A1 (en) * 2018-06-15 2019-12-19 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1143021A (en) * 1965-10-01 1969-02-19 Itek Corp Photographic metal salt transfer process
US3663242A (en) * 1970-09-25 1972-05-16 Shipley Co Stabilized electroless plating solutions

Also Published As

Publication number Publication date
JPS50119726A (fr) 1975-09-19
GB1490914A (en) 1977-11-02
FR2262123B1 (fr) 1978-08-18
DE2505958A1 (de) 1975-08-28
DE2505958C3 (de) 1982-04-22
DE2505958B2 (de) 1981-08-06
CA1069367A (fr) 1980-01-08
US4248633A (en) 1981-02-03
BE825773A (fr) 1975-08-20
FR2262123A1 (fr) 1975-09-19
NL7402422A (nl) 1975-08-26

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