JPS56151746A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS56151746A
JPS56151746A JP5417180A JP5417180A JPS56151746A JP S56151746 A JPS56151746 A JP S56151746A JP 5417180 A JP5417180 A JP 5417180A JP 5417180 A JP5417180 A JP 5417180A JP S56151746 A JPS56151746 A JP S56151746A
Authority
JP
Japan
Prior art keywords
polyallylic
amine compound
heat
ester compound
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5417180A
Other languages
Japanese (ja)
Other versions
JPS6342653B2 (en
Inventor
Akio Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5417180A priority Critical patent/JPS56151746A/en
Publication of JPS56151746A publication Critical patent/JPS56151746A/en
Publication of JPS6342653B2 publication Critical patent/JPS6342653B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To obtain the titled composition, having improved storage stability at ordinary temperature and rapid curability at a relatively low temperature, and moldable at a low pressure, by incorporating a specific polyallylic ester compound with a bismaleimide derivative and an amine compound.
CONSTITUTION: A polyallylic ester compound having one or more imide groups, e.g. formulas I and II (X is O, CH2, S, SO2, CO or direct bond) is incorporated with an N,N'-substituted bismaleimide derivative of formula III (R is alkylene or arylene) and an amine compound, e.g. a primary diamine or N-aryl substituted aromatic triamine. The resultant composition is then heated, kneaded and molded at 170°C and 70kg/cm2 in a short time of 1W5min to give a molded article having improved properties.
COPYRIGHT: (C)1981,JPO&Japio
JP5417180A 1980-04-25 1980-04-25 Heat-resistant resin composition Granted JPS56151746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5417180A JPS56151746A (en) 1980-04-25 1980-04-25 Heat-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5417180A JPS56151746A (en) 1980-04-25 1980-04-25 Heat-resistant resin composition

Publications (2)

Publication Number Publication Date
JPS56151746A true JPS56151746A (en) 1981-11-24
JPS6342653B2 JPS6342653B2 (en) 1988-08-24

Family

ID=12963088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5417180A Granted JPS56151746A (en) 1980-04-25 1980-04-25 Heat-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS56151746A (en)

Also Published As

Publication number Publication date
JPS6342653B2 (en) 1988-08-24

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