JPS56150897A - Method of manufacturing multilayer printed board - Google Patents
Method of manufacturing multilayer printed boardInfo
- Publication number
- JPS56150897A JPS56150897A JP5282080A JP5282080A JPS56150897A JP S56150897 A JPS56150897 A JP S56150897A JP 5282080 A JP5282080 A JP 5282080A JP 5282080 A JP5282080 A JP 5282080A JP S56150897 A JPS56150897 A JP S56150897A
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- multilayer printed
- manufacturing multilayer
- manufacturing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5282080A JPS56150897A (en) | 1980-04-23 | 1980-04-23 | Method of manufacturing multilayer printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5282080A JPS56150897A (en) | 1980-04-23 | 1980-04-23 | Method of manufacturing multilayer printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56150897A true JPS56150897A (en) | 1981-11-21 |
JPS6364079B2 JPS6364079B2 (enrdf_load_stackoverflow) | 1988-12-09 |
Family
ID=12925475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5282080A Granted JPS56150897A (en) | 1980-04-23 | 1980-04-23 | Method of manufacturing multilayer printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56150897A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS618996A (ja) * | 1984-06-25 | 1986-01-16 | 株式会社日立製作所 | 多層配線板の製造方法 |
JPS61252699A (ja) * | 1985-05-02 | 1986-11-10 | 株式会社日立製作所 | 多層配線板の製造方法 |
JPS62172795A (ja) * | 1986-01-24 | 1987-07-29 | 松下電器産業株式会社 | セラミツク多層基板 |
JPH01167079U (enrdf_load_stackoverflow) * | 1989-05-02 | 1989-11-22 | ||
JPH06232561A (ja) * | 1992-12-23 | 1994-08-19 | Internatl Business Mach Corp <Ibm> | 多層プリント回路基板またはカードおよびその製作方法、およびボール・ディスペンサ |
-
1980
- 1980-04-23 JP JP5282080A patent/JPS56150897A/ja active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS618996A (ja) * | 1984-06-25 | 1986-01-16 | 株式会社日立製作所 | 多層配線板の製造方法 |
JPS61252699A (ja) * | 1985-05-02 | 1986-11-10 | 株式会社日立製作所 | 多層配線板の製造方法 |
JPS62172795A (ja) * | 1986-01-24 | 1987-07-29 | 松下電器産業株式会社 | セラミツク多層基板 |
JPH01167079U (enrdf_load_stackoverflow) * | 1989-05-02 | 1989-11-22 | ||
JPH06232561A (ja) * | 1992-12-23 | 1994-08-19 | Internatl Business Mach Corp <Ibm> | 多層プリント回路基板またはカードおよびその製作方法、およびボール・ディスペンサ |
US5479703A (en) * | 1992-12-23 | 1996-01-02 | International Business Machines Corporation | Method of making a printed circuit board or card |
Also Published As
Publication number | Publication date |
---|---|
JPS6364079B2 (enrdf_load_stackoverflow) | 1988-12-09 |
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