JPS56147460A - Rectifier - Google Patents

Rectifier

Info

Publication number
JPS56147460A
JPS56147460A JP5029380A JP5029380A JPS56147460A JP S56147460 A JPS56147460 A JP S56147460A JP 5029380 A JP5029380 A JP 5029380A JP 5029380 A JP5029380 A JP 5029380A JP S56147460 A JPS56147460 A JP S56147460A
Authority
JP
Japan
Prior art keywords
recess
hole
metal body
cooling fin
caulked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5029380A
Other languages
Japanese (ja)
Inventor
Shigeki Yamada
Keigo Naoi
Akihiro Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5029380A priority Critical patent/JPS56147460A/en
Publication of JPS56147460A publication Critical patent/JPS56147460A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a rectifier which is readily manufactured and low in price, by a method wherein a dish-shaped recess is formed in a cooling fin, a hole is bored in the recess bottom, a metal body is inserted through the hole and caulked, and a rectifying element is soldered to the projecting surface inside the recess. CONSTITUTION:A dish-shaped recess 2 is formed in a cooling fin, a hole 13 are bored in the center of the recess bottom, and a connecting metal body is inserted through the hole. The projecting portions at both ends of the metal body are caulked, and on the projecting surface inside the recess 2, an Si element 3 and a connecting lead 4 piled up and soldered. Then, the recess 2 is filled with resin 5. As the fin, Al is employed, and as the connecting metal body, an Ni-plated material of iron or copper series is employed. By said constitution, the restriction by solderability is removed from the material for the cooling fin. Accordingly, it is possible to use a material advantageous in respect of cooling capacity, weight, price and the like, and manufacture is also facilitated, so that the cost lowers.
JP5029380A 1980-04-18 1980-04-18 Rectifier Pending JPS56147460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5029380A JPS56147460A (en) 1980-04-18 1980-04-18 Rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5029380A JPS56147460A (en) 1980-04-18 1980-04-18 Rectifier

Publications (1)

Publication Number Publication Date
JPS56147460A true JPS56147460A (en) 1981-11-16

Family

ID=12854856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5029380A Pending JPS56147460A (en) 1980-04-18 1980-04-18 Rectifier

Country Status (1)

Country Link
JP (1) JPS56147460A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61133652A (en) * 1984-11-30 1986-06-20 Hitachi Ltd Semiconductor rectifier

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49104136A (en) * 1973-02-09 1974-10-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49104136A (en) * 1973-02-09 1974-10-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61133652A (en) * 1984-11-30 1986-06-20 Hitachi Ltd Semiconductor rectifier

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