JPS56139941A - Mold - Google Patents
MoldInfo
- Publication number
- JPS56139941A JPS56139941A JP4363180A JP4363180A JPS56139941A JP S56139941 A JPS56139941 A JP S56139941A JP 4363180 A JP4363180 A JP 4363180A JP 4363180 A JP4363180 A JP 4363180A JP S56139941 A JPS56139941 A JP S56139941A
- Authority
- JP
- Japan
- Prior art keywords
- bush
- heat
- heat pipe
- section
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C45/7331—Heat transfer elements, e.g. heat pipes
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE:To prevent the temperature rise of a bush section and prevent the hardening of thermoset resin in the bush by a method wherein a heat pipe is constituted so as to have the spool bush as a heating section and the cooling section of said pipe is cooled from the outside of the mold. CONSTITUTION:The spool bush 20 is employed as the heating section of the heat pipe while a radiating fin 24 is employed as the cooling section of the heat pipe and both of them are connected by a pipe 23 filled with operating liquid. When heat is applied to the bush 20, the operating liquid absorbs the heat from the bush and is evaporated, then, is brought to the radiating fin section 24 being cooled by a fan 26 and is cooled, thereafter, is returned to the bush 20 again. The control of the temperature of the heat pipe is effected by detecting it with a temperature detecting element 25 and controlling the operation of the fan 26 through a control circuit 27. The temperature rise of an inner tube 22 is prevented by the effect of the heat pipe, therefore, poured resin will never be cured in a spool forming hole 10 by heat resulting in blocking said forming hole 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4363180A JPS56139941A (en) | 1980-04-04 | 1980-04-04 | Mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4363180A JPS56139941A (en) | 1980-04-04 | 1980-04-04 | Mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56139941A true JPS56139941A (en) | 1981-10-31 |
| JPS6160763B2 JPS6160763B2 (en) | 1986-12-22 |
Family
ID=12669198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4363180A Granted JPS56139941A (en) | 1980-04-04 | 1980-04-04 | Mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56139941A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58104621U (en) * | 1982-01-07 | 1983-07-16 | 東芝ケミカル株式会社 | mold for molding |
| JPH01159221A (en) * | 1987-12-17 | 1989-06-22 | Tdk Corp | Molding device for optical disk |
| JPH05220792A (en) * | 1992-02-17 | 1993-08-31 | Sumitomo Bakelite Co Ltd | Thermosetting resin molding metal die |
| KR100315355B1 (en) * | 1999-08-26 | 2001-11-30 | 류정열 | A mold for trunk floor having heat pipes for cooling itself |
| US20170025643A1 (en) * | 2015-07-23 | 2017-01-26 | Boe Technology Group Co., Ltd. | Crucible and evaporation device |
-
1980
- 1980-04-04 JP JP4363180A patent/JPS56139941A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58104621U (en) * | 1982-01-07 | 1983-07-16 | 東芝ケミカル株式会社 | mold for molding |
| JPH01159221A (en) * | 1987-12-17 | 1989-06-22 | Tdk Corp | Molding device for optical disk |
| JPH05220792A (en) * | 1992-02-17 | 1993-08-31 | Sumitomo Bakelite Co Ltd | Thermosetting resin molding metal die |
| KR100315355B1 (en) * | 1999-08-26 | 2001-11-30 | 류정열 | A mold for trunk floor having heat pipes for cooling itself |
| US20170025643A1 (en) * | 2015-07-23 | 2017-01-26 | Boe Technology Group Co., Ltd. | Crucible and evaporation device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6160763B2 (en) | 1986-12-22 |
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