JPS56131636A - Preparation of highly electroconductive acetylene high polymer molded product - Google Patents
Preparation of highly electroconductive acetylene high polymer molded productInfo
- Publication number
- JPS56131636A JPS56131636A JP3468680A JP3468680A JPS56131636A JP S56131636 A JPS56131636 A JP S56131636A JP 3468680 A JP3468680 A JP 3468680A JP 3468680 A JP3468680 A JP 3468680A JP S56131636 A JPS56131636 A JP S56131636A
- Authority
- JP
- Japan
- Prior art keywords
- high polymer
- acetylene high
- molded product
- compd
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE: To obtain the titled molded product useful as a material for an electric device etc., by the pressure molding and the calendering of a gel-like material consisting of an acetylene high polymer and an inert org. solvent, followed by treatment with an electron acceptor or donor compd.
CONSTITUTION: A gel-like material consisting of 5W95wt% acetylene high polymer of 50% or more cis content and 95W5wt% inert org. solvent (e.g., toluene) is molded under pressure at a temp ≤50°C and at a pressure of 10W1,000Kg/cm2. It is possible to freely control electrical conductivity over a wide rang from 10-8W3×10-3 Ω-1.cm-1, by treating an acetylene high polymer sheet or film obtd. by the calendering of the resulting molded product at a temp. ≤50°C, with an electron accepting compd. (e.g., iodine or sulfuric acid) or an electron donor compd. (e.g., Na or K). The highly conductive acetylene high polymer is a P type or n type semiconductor, and it is possible to use it as an electrical or electronic device. It is also possible to produce a P-n heterojunction device by use of it depending on combination.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3468680A JPS56131636A (en) | 1980-03-21 | 1980-03-21 | Preparation of highly electroconductive acetylene high polymer molded product |
| US06/222,905 US4362680A (en) | 1980-03-21 | 1981-01-05 | Process for production of molded articles of acetylene polymer |
| GB8101514A GB2072197B (en) | 1980-03-21 | 1981-01-19 | Process for producing molded articles of acetylene polymers |
| FR8105503A FR2478525A1 (en) | 1980-03-21 | 1981-03-19 | PROCESS FOR MANUFACTURING A MOLDED ARTICLE IN A HIGH POLYMER OF ACETYLENE |
| DE3111031A DE3111031C2 (en) | 1980-03-21 | 1981-03-20 | Process for the production of a molded article from a high polymer of acetylene |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3468680A JPS56131636A (en) | 1980-03-21 | 1980-03-21 | Preparation of highly electroconductive acetylene high polymer molded product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56131636A true JPS56131636A (en) | 1981-10-15 |
| JPS6226652B2 JPS6226652B2 (en) | 1987-06-10 |
Family
ID=12421275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3468680A Granted JPS56131636A (en) | 1980-03-21 | 1980-03-21 | Preparation of highly electroconductive acetylene high polymer molded product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56131636A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07141734A (en) * | 1993-11-19 | 1995-06-02 | Akai Electric Co Ltd | Device for releasing lock of front cover of cassette in vtr and the like |
-
1980
- 1980-03-21 JP JP3468680A patent/JPS56131636A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6226652B2 (en) | 1987-06-10 |
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