JPS56129353A - Cooling method for electronic equipment - Google Patents

Cooling method for electronic equipment

Info

Publication number
JPS56129353A
JPS56129353A JP3187480A JP3187480A JPS56129353A JP S56129353 A JPS56129353 A JP S56129353A JP 3187480 A JP3187480 A JP 3187480A JP 3187480 A JP3187480 A JP 3187480A JP S56129353 A JPS56129353 A JP S56129353A
Authority
JP
Japan
Prior art keywords
heat conductive
container
conductive member
lsi
efficiency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3187480A
Other languages
Japanese (ja)
Inventor
Hisao Meguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3187480A priority Critical patent/JPS56129353A/en
Publication of JPS56129353A publication Critical patent/JPS56129353A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To make LSI uniformly radiate heat with efficiency by a method wherein a cooling liquid is injected into a container with a heat conductive member, using the liquid pressure for letting the heat conductive member contact an IC. CONSTITUTION:When water is led to a container 5 from an injecting port 9 in an arrow direction B, the water pressure is applied to the direction of C. By this pres- sure, a cover 7 made of soft resins attached to the container 5 is inflated, allowing a heat conductive member 8 passed through the cover 7 to stick to a print card 3 mounted on an LSI1 with suitable force. Since this contact is one between metal objects, heat conductive loss is quite small. Thus, it is possible to radiate heat from the LSI uniformly with efficiency. For this reason, reliability of electronic parts is further increased, while the packaging of highly integrated LSI becomes possible.
JP3187480A 1980-03-13 1980-03-13 Cooling method for electronic equipment Pending JPS56129353A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3187480A JPS56129353A (en) 1980-03-13 1980-03-13 Cooling method for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3187480A JPS56129353A (en) 1980-03-13 1980-03-13 Cooling method for electronic equipment

Publications (1)

Publication Number Publication Date
JPS56129353A true JPS56129353A (en) 1981-10-09

Family

ID=12343176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3187480A Pending JPS56129353A (en) 1980-03-13 1980-03-13 Cooling method for electronic equipment

Country Status (1)

Country Link
JP (1) JPS56129353A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
US6845014B2 (en) 1992-05-20 2005-01-18 Seiko Epson Corporation Cartridge for electronic devices
US7035108B2 (en) 1992-05-20 2006-04-25 Seiko Epson Corporation Information processing device

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