JPS56129346A - Apparatus for welding seam - Google Patents

Apparatus for welding seam

Info

Publication number
JPS56129346A
JPS56129346A JP17211180A JP17211180A JPS56129346A JP S56129346 A JPS56129346 A JP S56129346A JP 17211180 A JP17211180 A JP 17211180A JP 17211180 A JP17211180 A JP 17211180A JP S56129346 A JPS56129346 A JP S56129346A
Authority
JP
Japan
Prior art keywords
cap
electrodes
contact
welded
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17211180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6250227B2 (enExample
Inventor
Masami Kiyono
Toshikazu Oshino
Toshiro Iba
Mitsuyoshi Oyama
Hisashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17211180A priority Critical patent/JPS56129346A/ja
Publication of JPS56129346A publication Critical patent/JPS56129346A/ja
Publication of JPS6250227B2 publication Critical patent/JPS6250227B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
JP17211180A 1980-12-08 1980-12-08 Apparatus for welding seam Granted JPS56129346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17211180A JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17211180A JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP14503975A Division JPS5268837A (en) 1975-12-08 1975-12-08 Atmospheric seam welding process

Publications (2)

Publication Number Publication Date
JPS56129346A true JPS56129346A (en) 1981-10-09
JPS6250227B2 JPS6250227B2 (enExample) 1987-10-23

Family

ID=15935751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17211180A Granted JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Country Status (1)

Country Link
JP (1) JPS56129346A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006341302A (ja) * 2005-06-10 2006-12-21 Origin Electric Co Ltd シーム接合方法及びシーム接合装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006341302A (ja) * 2005-06-10 2006-12-21 Origin Electric Co Ltd シーム接合方法及びシーム接合装置

Also Published As

Publication number Publication date
JPS6250227B2 (enExample) 1987-10-23

Similar Documents

Publication Publication Date Title
AU8121275A (en) Arc welding electrode for thin workpieces
CA981161A (en) Method and means for electrode welding
CA985746A (en) Process for out-of-position welding and electrode
GB2021370B (en) Non-consumable electrode for plasma-arc welding and methodof manufacture thereof
CA1031830A (en) Rotating arc welding method and apparatus
CA919261A (en) Arc welding electrode and process for stainless steel
JPS56129346A (en) Apparatus for welding seam
ZA734293B (en) A method of electric welding by transferred plasma and a welding torch for carrying said method into effect
CA972821A (en) Contact nozzle for a continuous arc welding electrode
CA959942A (en) Method and apparatus for electric arc welding
EP0214560A3 (en) Continuous motion circumferential seam welder
JPS53123787A (en) Travelling speed correction instruction for a method and its apparatus multiaxial direction moving body and memory regenerating
JPS56168998A (en) Weldment positioner for tank having curved surface of revolution
JPS5755060A (en) Laser welded mouth sealing device
GB1426110A (en) Drying of surfaces
JPS56128680A (en) Seam welding device
AU4124872A (en) Welding control apparatus for applying weld material to contoured surfaces
JPS5548490A (en) Plate welding method inside of box-shaped structure
ES421363A1 (es) Procedimiento y dispositivo para soldar a tope en forma continua chapa metalica formando una costura.
JPS56151176A (en) Arc welding method
FR2344765A1 (fr) Procede pour joindre deux ou plusieurs elements avec un agent d'etancheite entre eux
JPS5343478A (en) Roll electrode for cap sealing of semiconductor device
JPS5717388A (en) Seam welding method
GB2016345B (en) Process and apparatus for controlling the electrode on a spark erosion machine
JPS5389370A (en) Roll electrode for hermetic sealing of semiconductor device