JPS5612746A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS5612746A
JPS5612746A JP8702879A JP8702879A JPS5612746A JP S5612746 A JPS5612746 A JP S5612746A JP 8702879 A JP8702879 A JP 8702879A JP 8702879 A JP8702879 A JP 8702879A JP S5612746 A JPS5612746 A JP S5612746A
Authority
JP
Japan
Prior art keywords
wire
circuit elements
integrated circuit
semiconductor integrated
disconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8702879A
Other languages
Japanese (ja)
Inventor
Hiroshi Morikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8702879A priority Critical patent/JPS5612746A/en
Publication of JPS5612746A publication Critical patent/JPS5612746A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Bipolar Integrated Circuits (AREA)

Abstract

PURPOSE:To eliminate the disconnection of a wire with a simple separation process by electrically insulated separation between the circuit elements with organic high polymers. CONSTITUTION:An n<+> buried layer 2 is formed on the p<-> silicon substrate 3 and an n<-> epitaxial layer 1 is grown thereon. The circuit elements are formed on the epitaxial layer 1 on the buried layer 2. An organic high polymer 8 such as polyimide is applied thick in the etched groove formed between the circuit elements and the wire 9 of Al or the like is provided. This simplifies the insulated separation process while easing the roughness of the wafer surface, and the surface becomes almost flat thereby checking disconnection or the like of the wire 9.
JP8702879A 1979-07-10 1979-07-10 Semiconductor integrated circuit Pending JPS5612746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8702879A JPS5612746A (en) 1979-07-10 1979-07-10 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8702879A JPS5612746A (en) 1979-07-10 1979-07-10 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5612746A true JPS5612746A (en) 1981-02-07

Family

ID=13903492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8702879A Pending JPS5612746A (en) 1979-07-10 1979-07-10 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5612746A (en)

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