JPS5598848A - Resin-sealed type semiconductor device - Google Patents
Resin-sealed type semiconductor deviceInfo
- Publication number
- JPS5598848A JPS5598848A JP604079A JP604079A JPS5598848A JP S5598848 A JPS5598848 A JP S5598848A JP 604079 A JP604079 A JP 604079A JP 604079 A JP604079 A JP 604079A JP S5598848 A JPS5598848 A JP S5598848A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- tetra
- substituted
- content
- antimony trioxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP604079A JPS5598848A (en) | 1979-01-24 | 1979-01-24 | Resin-sealed type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP604079A JPS5598848A (en) | 1979-01-24 | 1979-01-24 | Resin-sealed type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5598848A true JPS5598848A (en) | 1980-07-28 |
Family
ID=11627518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP604079A Pending JPS5598848A (en) | 1979-01-24 | 1979-01-24 | Resin-sealed type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5598848A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006022693A1 (en) * | 2004-08-05 | 2006-03-02 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
JP2006158004A (ja) * | 2004-11-25 | 2006-06-15 | Shimadzu Corp | 電動アクチュエータ |
US7247683B2 (en) | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
US7673715B2 (en) | 2003-10-10 | 2010-03-09 | Sumitomo Heavy Industries, Ltd. | Geared motor for electric wheelchair |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4962085A (ja) * | 1972-10-06 | 1974-06-15 | ||
JPS50108400A (ja) * | 1974-02-01 | 1975-08-26 | ||
JPS50135984A (ja) * | 1974-04-17 | 1975-10-28 |
-
1979
- 1979-01-24 JP JP604079A patent/JPS5598848A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4962085A (ja) * | 1972-10-06 | 1974-06-15 | ||
JPS50108400A (ja) * | 1974-02-01 | 1975-08-26 | ||
JPS50135984A (ja) * | 1974-04-17 | 1975-10-28 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7673715B2 (en) | 2003-10-10 | 2010-03-09 | Sumitomo Heavy Industries, Ltd. | Geared motor for electric wheelchair |
WO2006022693A1 (en) * | 2004-08-05 | 2006-03-02 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
US7247683B2 (en) | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
JP2006158004A (ja) * | 2004-11-25 | 2006-06-15 | Shimadzu Corp | 電動アクチュエータ |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR860002139A (ko) | 반도체 봉합용 에폭시수지조성물과 그것을 이용한 수지 봉합형 반도체장치 | |
JPS5252958A (en) | Glass-fiber reinforced polyphenylene sulfide resin compositions | |
JPS5598848A (en) | Resin-sealed type semiconductor device | |
JPS52112698A (en) | Curable resin compositions | |
JPS5426000A (en) | Epoxy resin composition | |
JPS5359798A (en) | Epoxy resin composition of excellent warm-water resistance | |
JPS5375299A (en) | Epoxy resin composition | |
JPS52135673A (en) | Resin composition for semiconductor sealing | |
JPS5410400A (en) | Curable composition | |
JPS52150500A (en) | Epoxy resin compositions | |
JPS5216185A (en) | Bipolar type semiconductor integrated circuit device | |
JPS52172A (en) | Semiconductor | |
JPS55153357A (en) | Manufacturing method of resin sealed semiconductor device | |
JPS544994A (en) | Epoxy resin composition | |
JPS5297945A (en) | Acid anhydride composition | |
JPS5351298A (en) | Thermosetting resin composition | |
JPS5414499A (en) | Heat resistant resin composition | |
JPS5322589A (en) | Hardening resin composition | |
JPS52152991A (en) | Curable molding composition | |
JPS5767628A (en) | Curable composition containing spiro-orthoester compound | |
JPS5334897A (en) | Epoxy resin composition | |
JPS5483955A (en) | Resin composition for electrical radiation shielding | |
JPS52141844A (en) | Hot-melt adhesive compositions of polyesters | |
JPS5379938A (en) | Polyolefin resin composition containing inorganic filler | |
JPS5357300A (en) | Epoxy resin composition |