JPS5595345A - Metalizing method of sapphire - Google Patents

Metalizing method of sapphire

Info

Publication number
JPS5595345A
JPS5595345A JP250479A JP250479A JPS5595345A JP S5595345 A JPS5595345 A JP S5595345A JP 250479 A JP250479 A JP 250479A JP 250479 A JP250479 A JP 250479A JP S5595345 A JPS5595345 A JP S5595345A
Authority
JP
Japan
Prior art keywords
sapphire
layer
solder
metal
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP250479A
Other languages
Japanese (ja)
Inventor
Nobuyuki Mizunoya
Shigeo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP250479A priority Critical patent/JPS5595345A/en
Publication of JPS5595345A publication Critical patent/JPS5595345A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To form a metallized layer which has a high bonding strength between attached material and surface of sapphire.
CONSTITUTION: A metalized layer in which some glass components are added into a powder of Mo or W, is baked on a surface of sapphire 1. With this glass component, wetting property to the surface of sapphire is improved and a strong bonding is obtained, and also the powder is well combined. The glass component is, on consideration of atmosphere of the metalizing treatment, the termal expansion coefficient and the bonding strength, alumina as the main component and silica is added with mol ratio 1:8 and is mixed. By forming an Ni plated layer 3 on the metalized layer, immersion of solder into the layer 2 is prevented when the brazing is made. Then, an attached metal 5 is bonded with solder 4. An alloy having a thermal expansion coefficient close to that of sapphire is used for the metal 5, and the soldering is made using an Ag solder etc. having lower melting point than that of the layer 2. With this method, it is able to bond strongly an attached metal on sapphire.
COPYRIGHT: (C)1980,JPO&Japio
JP250479A 1979-01-12 1979-01-12 Metalizing method of sapphire Pending JPS5595345A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP250479A JPS5595345A (en) 1979-01-12 1979-01-12 Metalizing method of sapphire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP250479A JPS5595345A (en) 1979-01-12 1979-01-12 Metalizing method of sapphire

Publications (1)

Publication Number Publication Date
JPS5595345A true JPS5595345A (en) 1980-07-19

Family

ID=11531183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP250479A Pending JPS5595345A (en) 1979-01-12 1979-01-12 Metalizing method of sapphire

Country Status (1)

Country Link
JP (1) JPS5595345A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113862611A (en) * 2021-09-30 2021-12-31 台州星星光电科技有限公司 Strong-alkali-resistant sapphire glass panel surface coating method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113862611A (en) * 2021-09-30 2021-12-31 台州星星光电科技有限公司 Strong-alkali-resistant sapphire glass panel surface coating method

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