JPS5594793A - Cream solder - Google Patents

Cream solder

Info

Publication number
JPS5594793A
JPS5594793A JP124079A JP124079A JPS5594793A JP S5594793 A JPS5594793 A JP S5594793A JP 124079 A JP124079 A JP 124079A JP 124079 A JP124079 A JP 124079A JP S5594793 A JPS5594793 A JP S5594793A
Authority
JP
Japan
Prior art keywords
flux
solder
powder
dissolve
broken
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP124079A
Other languages
Japanese (ja)
Inventor
Michio Nakamura
Toshihiko Yamazaki
Akinobu Takezoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Nisshin Co Ltd
Original Assignee
Nisshin Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nisshin Steel Co Ltd filed Critical Nisshin Steel Co Ltd
Priority to JP124079A priority Critical patent/JPS5594793A/en
Publication of JPS5594793A publication Critical patent/JPS5594793A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries

Abstract

PURPOSE:To prevent the chemical reaction through direct contact of solder powder and flux and prevent the degradation in soldering performance by coating the solder powder with the material which is hard to dissolve in flux and is dissolved or broken by heat. CONSTITUTION:The solder powder which is composed of Sn-Pb or the like and has been made to fine powder of about 100-300 mesh is coated with gelatine or the like which is hard to dissolve in flux and is dissolved or broken by the temperature lower than the melting temperature of the solder. It is then made into fine granular capsules. The fine granular capsules and flux are mixed and agitated. Since this cream solder does not cause chemical reaction through the direct contact of the powder and flux, its life is prolonged without impairment of its solderability for a long period of time.
JP124079A 1979-01-12 1979-01-12 Cream solder Pending JPS5594793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP124079A JPS5594793A (en) 1979-01-12 1979-01-12 Cream solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP124079A JPS5594793A (en) 1979-01-12 1979-01-12 Cream solder

Publications (1)

Publication Number Publication Date
JPS5594793A true JPS5594793A (en) 1980-07-18

Family

ID=11495929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP124079A Pending JPS5594793A (en) 1979-01-12 1979-01-12 Cream solder

Country Status (1)

Country Link
JP (1) JPS5594793A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113197A (en) * 1987-10-27 1989-05-01 Takashi Niimura Coating soldering powder
JPH01113198A (en) * 1987-10-27 1989-05-01 Takashi Niimura Soldering paste
WO2008011933A2 (en) * 2006-07-28 2008-01-31 Ks Aluminium-Technologie Gmbh Flux, and method for the reduction of oxide layers on metallic surfaces
US8652269B2 (en) 2008-10-02 2014-02-18 Nihon Superior Co., Ltd. Flux composition and soldering paste composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113197A (en) * 1987-10-27 1989-05-01 Takashi Niimura Coating soldering powder
JPH01113198A (en) * 1987-10-27 1989-05-01 Takashi Niimura Soldering paste
WO2008011933A2 (en) * 2006-07-28 2008-01-31 Ks Aluminium-Technologie Gmbh Flux, and method for the reduction of oxide layers on metallic surfaces
WO2008011933A3 (en) * 2006-07-28 2008-04-03 Ks Aluminium Technologie Ag Flux, and method for the reduction of oxide layers on metallic surfaces
US8652269B2 (en) 2008-10-02 2014-02-18 Nihon Superior Co., Ltd. Flux composition and soldering paste composition

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