JPS5591830A - Method of visualizing defect on surface of polished silicon wafer - Google Patents

Method of visualizing defect on surface of polished silicon wafer

Info

Publication number
JPS5591830A
JPS5591830A JP15824479A JP15824479A JPS5591830A JP S5591830 A JPS5591830 A JP S5591830A JP 15824479 A JP15824479 A JP 15824479A JP 15824479 A JP15824479 A JP 15824479A JP S5591830 A JPS5591830 A JP S5591830A
Authority
JP
Japan
Prior art keywords
silicon wafer
polished silicon
visualizing
defect
visualizing defect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15824479A
Other languages
English (en)
Other versions
JPS5757862B2 (ja
Inventor
Guuoo Shia Guwaangu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5591830A publication Critical patent/JPS5591830A/ja
Publication of JPS5757862B2 publication Critical patent/JPS5757862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8803Visual inspection

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Weting (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP15824479A 1978-12-29 1979-12-07 Method of visualizing defect on surface of polished silicon wafer Granted JPS5591830A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/974,586 US4238275A (en) 1978-12-29 1978-12-29 Pyrocatechol-amine-water solution for the determination of defects

Publications (2)

Publication Number Publication Date
JPS5591830A true JPS5591830A (en) 1980-07-11
JPS5757862B2 JPS5757862B2 (ja) 1982-12-07

Family

ID=25522220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15824479A Granted JPS5591830A (en) 1978-12-29 1979-12-07 Method of visualizing defect on surface of polished silicon wafer

Country Status (6)

Country Link
US (1) US4238275A (ja)
EP (1) EP0012861B1 (ja)
JP (1) JPS5591830A (ja)
CA (1) CA1109372A (ja)
DE (1) DE2965006D1 (ja)
IT (1) IT1165405B (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6139559U (ja) * 1984-08-13 1986-03-12 正重 田渕 屋外据付け型の消火用ホ−ス格納庫
US7205265B2 (en) 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US20040018949A1 (en) * 1990-11-05 2004-01-29 Wai Mun Lee Semiconductor process residue removal composition and process
US6000411A (en) * 1990-11-05 1999-12-14 Ekc Technology, Inc. Cleaning compositions for removing etching residue and method of using
US6242400B1 (en) 1990-11-05 2001-06-05 Ekc Technology, Inc. Method of stripping resists from substrates using hydroxylamine and alkanolamine
US6110881A (en) * 1990-11-05 2000-08-29 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US6121217A (en) 1990-11-05 2000-09-19 Ekc Technology, Inc. Alkanolamine semiconductor process residue removal composition and process
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US7144849B2 (en) * 1993-06-21 2006-12-05 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US5573680A (en) * 1994-08-01 1996-11-12 Memc Electronic Materials, Inc. Method for etching a semiconductor material without altering flow pattern defect distribution
US6403385B1 (en) * 1998-01-27 2002-06-11 Advanced Micro Devices, Inc. Method of inspecting a semiconductor wafer for defects
US6600557B1 (en) * 1999-05-21 2003-07-29 Memc Electronic Materials, Inc. Method for the detection of processing-induced defects in a silicon wafer
JP2002118083A (ja) * 2000-10-05 2002-04-19 Hitachi Ltd 半導体集積回路装置の製造方法
CN102735758A (zh) * 2012-06-13 2012-10-17 鞍钢股份有限公司 一种无损检测换能器表面缺陷的修复方法
CN104900758B (zh) * 2015-05-25 2017-03-15 连云港市产品质量监督检验中心 一种准单晶硅片微缺陷的检测方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1288278A (ja) * 1968-12-31 1972-09-06
GB1211499A (en) * 1969-03-07 1970-11-04 Standard Telephones Cables Ltd A method of manufacturing semiconductor devices
US3728179A (en) * 1970-05-20 1973-04-17 Radiation Inc Method of etching silicon crystals
US3718514A (en) * 1971-05-28 1973-02-27 Bell Telephone Labor Inc Removal of projections on epitaxial layers
US3834959A (en) * 1972-06-30 1974-09-10 Ibm Process for the formation of selfaligned silicon and aluminum gates

Also Published As

Publication number Publication date
IT1165405B (it) 1987-04-22
EP0012861A1 (de) 1980-07-09
IT7928246A0 (it) 1979-12-20
CA1109372A (en) 1981-09-22
DE2965006D1 (en) 1983-04-14
EP0012861B1 (de) 1983-03-09
JPS5757862B2 (ja) 1982-12-07
US4238275A (en) 1980-12-09

Similar Documents

Publication Publication Date Title
JPS52117060A (en) Method of cleaning silicon wafers
GB2021979B (en) Applying processing fluid onto silicon wafers
JPS5658239A (en) Method of forming semiconductor on main surface of silicon semiconductor body
JPS5720436A (en) Method and device for improving flatness of polished wafer
GB2035986B (en) Method for preparing an abrasive silicon oxide layer
JPS5591830A (en) Method of visualizing defect on surface of polished silicon wafer
GB2079532B (en) Method and apparatus for wax mounting of thin wafers for polishing
JPS5562725A (en) Method of forming narrow diffused region on silicon substrate
JPS52144270A (en) Method of making silicon usable for semiconductor element
JPS55105382A (en) Method of roughening surface of silicon substrate
JPS5432262A (en) Method of removing silica residue on semiconductor surface
DE3068862D1 (en) Method of surface-treating semiconductor substrate
JPS5567142A (en) Method of manufacturing wafer silicon semiconductor part having negative bevel unit
JPS558097A (en) Method of manufacturing semiconductor ic
JPS57139936A (en) Method of characterizing semiconductor wafer
JPS55150234A (en) Method of etching wafer
GB2035690B (en) Semiconductor device and a method of contacting a partial region of a semiconductor surface
JPS54134557A (en) Method of adhering liquid substance on semiconductor wafer
JPS5381066A (en) Method of detecting crystal defect of semiconductor silicon
JPS52154362A (en) Method of forming semiconductor surface of 335 group compound
JPS52144020A (en) Method of etching glass surface
JPS5330876A (en) Method of cleaning surface of semiconductor
JPS51150972A (en) Process for cleaning semiconductor substrate polished
IL58443A0 (en) Method of cleaving semiconductor wafers
ZA792082B (en) Method of manufacturing an object of silicon nitride