JPS5586354U - - Google Patents
Info
- Publication number
- JPS5586354U JPS5586354U JP1978169072U JP16907278U JPS5586354U JP S5586354 U JPS5586354 U JP S5586354U JP 1978169072 U JP1978169072 U JP 1978169072U JP 16907278 U JP16907278 U JP 16907278U JP S5586354 U JPS5586354 U JP S5586354U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978169072U JPS5586354U (ja) | 1978-12-11 | 1978-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978169072U JPS5586354U (ja) | 1978-12-11 | 1978-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5586354U true JPS5586354U (ja) | 1980-06-14 |
Family
ID=29170801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978169072U Pending JPS5586354U (ja) | 1978-12-11 | 1978-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5586354U (ja) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58105154U (ja) * | 1982-01-11 | 1983-07-18 | 三洋電機株式会社 | 半導体装置 |
| JPS6431450A (en) * | 1987-07-28 | 1989-02-01 | Nec Corp | Ic package |
| JPH01147850A (ja) * | 1987-12-04 | 1989-06-09 | Fuji Electric Co Ltd | 多層形半導体装置 |
| JPH10107188A (ja) * | 1996-09-27 | 1998-04-24 | Kyocera Corp | 半導体装置 |
| JP2003502852A (ja) * | 1999-06-17 | 2003-01-21 | テレフオンアクチーボラゲツト エル エム エリクソン（パブル） | 多層プリント回路板へチップを装着するための構成 |
| JP2006319136A (ja) * | 2005-05-12 | 2006-11-24 | Mitsubishi Electric Corp | 高周波モジュール |
-
1978
- 1978-12-11 JP JP1978169072U patent/JPS5586354U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58105154U (ja) * | 1982-01-11 | 1983-07-18 | 三洋電機株式会社 | 半導体装置 |
| JPS6431450A (en) * | 1987-07-28 | 1989-02-01 | Nec Corp | Ic package |
| JPH01147850A (ja) * | 1987-12-04 | 1989-06-09 | Fuji Electric Co Ltd | 多層形半導体装置 |
| JPH10107188A (ja) * | 1996-09-27 | 1998-04-24 | Kyocera Corp | 半導体装置 |
| JP2003502852A (ja) * | 1999-06-17 | 2003-01-21 | テレフオンアクチーボラゲツト エル エム エリクソン（パブル） | 多層プリント回路板へチップを装着するための構成 |
| JP2006319136A (ja) * | 2005-05-12 | 2006-11-24 | Mitsubishi Electric Corp | 高周波モジュール |