JPS5585050A - Connecting method for lead wire in semiconductor device - Google Patents

Connecting method for lead wire in semiconductor device

Info

Publication number
JPS5585050A
JPS5585050A JP16555178A JP16555178A JPS5585050A JP S5585050 A JPS5585050 A JP S5585050A JP 16555178 A JP16555178 A JP 16555178A JP 16555178 A JP16555178 A JP 16555178A JP S5585050 A JPS5585050 A JP S5585050A
Authority
JP
Japan
Prior art keywords
lead wire
cylinder
coupling cylinder
jig
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16555178A
Other languages
Japanese (ja)
Inventor
Mitsuo Odate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16555178A priority Critical patent/JPS5585050A/en
Publication of JPS5585050A publication Critical patent/JPS5585050A/en
Pending legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE: To decrease electric contact resistance, and increasing the mechanical strength of a portion where a lead wire and a coupling cylinder are connected while improving the accuracy of finishing, by connecting the lead wire and the coupling cylinder by using electromagnetic molding.
CONSTITUTION: One end of a lead wire 3 is inserted into a hole 4a of a coupling cylinder 4. One end portion of the coupling cylinder 4 into which the lead wire 3 is inserted is inserted into a cylinder jig 7 for molding, and arranged on the same so that the coupling cylinder 4 does not contact with the inner surface of jig 7. A switch 9 is make ON, and electric energy stored in a capacitor 10 is charged to a coil 8 of the cylinder jig 7. Eddy currents are generated in the lead wire 3 and the coupling cylinder 4 so as to eliminate a magnetic field formed in the cylinder jig 7 at that time, the lead wire 3 and the relay cylinder 4 are deformed in circular arc- like shapes and plastically toward the inside by the interaction of these magnetic field and eddy currents, and the lead wire 3 and the coupling cylinder 4 are press- welded.
COPYRIGHT: (C)1980,JPO&Japio
JP16555178A 1978-12-21 1978-12-21 Connecting method for lead wire in semiconductor device Pending JPS5585050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16555178A JPS5585050A (en) 1978-12-21 1978-12-21 Connecting method for lead wire in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16555178A JPS5585050A (en) 1978-12-21 1978-12-21 Connecting method for lead wire in semiconductor device

Publications (1)

Publication Number Publication Date
JPS5585050A true JPS5585050A (en) 1980-06-26

Family

ID=15814511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16555178A Pending JPS5585050A (en) 1978-12-21 1978-12-21 Connecting method for lead wire in semiconductor device

Country Status (1)

Country Link
JP (1) JPS5585050A (en)

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