JPS5585050A - Connecting method for lead wire in semiconductor device - Google Patents
Connecting method for lead wire in semiconductor deviceInfo
- Publication number
- JPS5585050A JPS5585050A JP16555178A JP16555178A JPS5585050A JP S5585050 A JPS5585050 A JP S5585050A JP 16555178 A JP16555178 A JP 16555178A JP 16555178 A JP16555178 A JP 16555178A JP S5585050 A JPS5585050 A JP S5585050A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- cylinder
- coupling cylinder
- jig
- coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
PURPOSE: To decrease electric contact resistance, and increasing the mechanical strength of a portion where a lead wire and a coupling cylinder are connected while improving the accuracy of finishing, by connecting the lead wire and the coupling cylinder by using electromagnetic molding.
CONSTITUTION: One end of a lead wire 3 is inserted into a hole 4a of a coupling cylinder 4. One end portion of the coupling cylinder 4 into which the lead wire 3 is inserted is inserted into a cylinder jig 7 for molding, and arranged on the same so that the coupling cylinder 4 does not contact with the inner surface of jig 7. A switch 9 is make ON, and electric energy stored in a capacitor 10 is charged to a coil 8 of the cylinder jig 7. Eddy currents are generated in the lead wire 3 and the coupling cylinder 4 so as to eliminate a magnetic field formed in the cylinder jig 7 at that time, the lead wire 3 and the relay cylinder 4 are deformed in circular arc- like shapes and plastically toward the inside by the interaction of these magnetic field and eddy currents, and the lead wire 3 and the coupling cylinder 4 are press- welded.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16555178A JPS5585050A (en) | 1978-12-21 | 1978-12-21 | Connecting method for lead wire in semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16555178A JPS5585050A (en) | 1978-12-21 | 1978-12-21 | Connecting method for lead wire in semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5585050A true JPS5585050A (en) | 1980-06-26 |
Family
ID=15814511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16555178A Pending JPS5585050A (en) | 1978-12-21 | 1978-12-21 | Connecting method for lead wire in semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5585050A (en) |
-
1978
- 1978-12-21 JP JP16555178A patent/JPS5585050A/en active Pending
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