JPS5573496A - Production of lead-tin-silver alloy base solder - Google Patents

Production of lead-tin-silver alloy base solder

Info

Publication number
JPS5573496A
JPS5573496A JP14576978A JP14576978A JPS5573496A JP S5573496 A JPS5573496 A JP S5573496A JP 14576978 A JP14576978 A JP 14576978A JP 14576978 A JP14576978 A JP 14576978A JP S5573496 A JPS5573496 A JP S5573496A
Authority
JP
Japan
Prior art keywords
alloy base
tin
lead
production
ag3sn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14576978A
Other languages
Japanese (ja)
Inventor
Susumu Watanabe
Akio Hori
Tetsuo Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14576978A priority Critical patent/JPS5573496A/en
Publication of JPS5573496A publication Critical patent/JPS5573496A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To obtain the solder which is capable of providing the bond part of superior mechanical characteristics and free from local deterioration and rupture by adding Sn and Ag components as stable Ag3Sn compound powder to Pb without separately adding these. CONSTITUTION:In the case of making the Pb-Sn-Ag alloy base solder, Sn and Ag components are added as Ag3Sn compound to Pb. Thence, this is heat treated at the decomposition temperature or less of the Ag3Sn compound to allow Ag3Sn compound to disperse. Here, it is desirable that the addition ratio of the Ag3Sn compound be made within a range of 2-5wt% based on the weight of Pb.
JP14576978A 1978-11-25 1978-11-25 Production of lead-tin-silver alloy base solder Pending JPS5573496A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14576978A JPS5573496A (en) 1978-11-25 1978-11-25 Production of lead-tin-silver alloy base solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14576978A JPS5573496A (en) 1978-11-25 1978-11-25 Production of lead-tin-silver alloy base solder

Publications (1)

Publication Number Publication Date
JPS5573496A true JPS5573496A (en) 1980-06-03

Family

ID=15392728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14576978A Pending JPS5573496A (en) 1978-11-25 1978-11-25 Production of lead-tin-silver alloy base solder

Country Status (1)

Country Link
JP (1) JPS5573496A (en)

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