JPS5573428A - Cutting and holing method of aluminum material - Google Patents

Cutting and holing method of aluminum material

Info

Publication number
JPS5573428A
JPS5573428A JP14646478A JP14646478A JPS5573428A JP S5573428 A JPS5573428 A JP S5573428A JP 14646478 A JP14646478 A JP 14646478A JP 14646478 A JP14646478 A JP 14646478A JP S5573428 A JPS5573428 A JP S5573428A
Authority
JP
Japan
Prior art keywords
aluminum
copper
eutectic temperature
aluminum material
eutectic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14646478A
Other languages
Japanese (ja)
Inventor
Yoichi Wakabayashi
Izumi Ochiai
Tateo Tamamura
Kunio Miyazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14646478A priority Critical patent/JPS5573428A/en
Publication of JPS5573428A publication Critical patent/JPS5573428A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To facilitate opening of irregular shaped holes and flash removing of castings through the eutectic reaction of contact faces by forcing a knife-form or bar-form copper material into an aluminum material which has been heated to its eutectic temperature or more and its melting point or less.
CONSTITUTION: A copper knife 2 is forced into an aluminum base material 1 which has been heated partially or wholly to its eutectic temperature 548°C or more and to the melting point of aluminum material or less to caused eutecting melting at the contact faces of both materials and fusion-cut the materials. Also, holing is done in the similar manner by forcing a copper material 3 to the material. If the thermal deformation of the aluminum base material 1 is of problem, heating the material in such a manner that the eutectic temperature of more is reached by contacting between the copper material and aluminum material is equally well and it is also possible to perform continuous working by maintaining the copper material at a high temperature. In addition, similar working may be done as well even by making use of the heat after casting or forging.
COPYRIGHT: (C)1980,JPO&Japio
JP14646478A 1978-11-29 1978-11-29 Cutting and holing method of aluminum material Pending JPS5573428A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14646478A JPS5573428A (en) 1978-11-29 1978-11-29 Cutting and holing method of aluminum material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14646478A JPS5573428A (en) 1978-11-29 1978-11-29 Cutting and holing method of aluminum material

Publications (1)

Publication Number Publication Date
JPS5573428A true JPS5573428A (en) 1980-06-03

Family

ID=15408221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14646478A Pending JPS5573428A (en) 1978-11-29 1978-11-29 Cutting and holing method of aluminum material

Country Status (1)

Country Link
JP (1) JPS5573428A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019189910A1 (en) * 2018-03-30 2019-10-03 大阪瓦斯株式会社 Punch hole forming method and punch hole forming device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019189910A1 (en) * 2018-03-30 2019-10-03 大阪瓦斯株式会社 Punch hole forming method and punch hole forming device
JP2019177417A (en) * 2018-03-30 2019-10-17 大阪瓦斯株式会社 Punch hole formation method and punch hole formation device

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