JPS5562777A - Shutter controller for camera - Google Patents

Shutter controller for camera

Info

Publication number
JPS5562777A
JPS5562777A JP13540578A JP13540578A JPS5562777A JP S5562777 A JPS5562777 A JP S5562777A JP 13540578 A JP13540578 A JP 13540578A JP 13540578 A JP13540578 A JP 13540578A JP S5562777 A JPS5562777 A JP S5562777A
Authority
JP
Japan
Prior art keywords
photosensitive
substrate
filter
window
color temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13540578A
Other languages
Japanese (ja)
Inventor
Hideo Hamamura
Osamu Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13540578A priority Critical patent/JPS5562777A/en
Publication of JPS5562777A publication Critical patent/JPS5562777A/en
Pending legal-status Critical Current

Links

Landscapes

  • Light Receiving Elements (AREA)
  • Exposure Control For Cameras (AREA)

Abstract

PURPOSE: To miniaturize the device, by connecting a photosensitive element to wiring while mounting the element so that a photosensitive surface peep throhgh a window bored to a substrate on whose surface a printed wire is installed, and by disposing a filter for correcting color temperature, which compensates the spectral sensitivity of the element to a relative luminosity factor of the naked eye, onto the back of the substrate.
CONSTITUTION: A window 14 is manufactured on a substrate 7 on which one surface a printed wire 8 is mounted. A photosensitive element 4 is installed to the printed wire 8 through the bump electrodes 13 of the element 4 so that a photosensitive surface of the element 4 and a filter 9 for correcting color temperature mutually face through the window 14. The filter 9 for correcting color temperature is disposed to the back of the substrate 7 in an airtight shape. The element 4 is protected with resin 15. According to this constitution, there is no necessity for using separate parts completed as photosensitive devices as seen in conventional devices, and the device can be miniaturized.
COPYRIGHT: (C)1980,JPO&Japio
JP13540578A 1978-11-01 1978-11-01 Shutter controller for camera Pending JPS5562777A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13540578A JPS5562777A (en) 1978-11-01 1978-11-01 Shutter controller for camera

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13540578A JPS5562777A (en) 1978-11-01 1978-11-01 Shutter controller for camera

Publications (1)

Publication Number Publication Date
JPS5562777A true JPS5562777A (en) 1980-05-12

Family

ID=15150948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13540578A Pending JPS5562777A (en) 1978-11-01 1978-11-01 Shutter controller for camera

Country Status (1)

Country Link
JP (1) JPS5562777A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5820545U (en) * 1981-08-03 1983-02-08 三菱電機株式会社 photoelectric sensor
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
US5194934A (en) * 1988-07-27 1993-03-16 Semiconductor Energy Laboratory Co., Ltd. Mounting structure for a semiconductor chip having a buffer layer
US5867368A (en) * 1997-09-09 1999-02-02 Amkor Technology, Inc. Mounting for a semiconductor integrated circuit device
US5949655A (en) * 1997-09-09 1999-09-07 Amkor Technology, Inc. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
US6448635B1 (en) 1999-08-30 2002-09-10 Amkor Technology, Inc. Surface acoustical wave flip chip

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5820545U (en) * 1981-08-03 1983-02-08 三菱電機株式会社 photoelectric sensor
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
US5194934A (en) * 1988-07-27 1993-03-16 Semiconductor Energy Laboratory Co., Ltd. Mounting structure for a semiconductor chip having a buffer layer
US5867368A (en) * 1997-09-09 1999-02-02 Amkor Technology, Inc. Mounting for a semiconductor integrated circuit device
US5949655A (en) * 1997-09-09 1999-09-07 Amkor Technology, Inc. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
US6448635B1 (en) 1999-08-30 2002-09-10 Amkor Technology, Inc. Surface acoustical wave flip chip

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