JPS5561051A - Method and device for correcting lead wire of electronic parts - Google Patents

Method and device for correcting lead wire of electronic parts

Info

Publication number
JPS5561051A
JPS5561051A JP13317678A JP13317678A JPS5561051A JP S5561051 A JPS5561051 A JP S5561051A JP 13317678 A JP13317678 A JP 13317678A JP 13317678 A JP13317678 A JP 13317678A JP S5561051 A JPS5561051 A JP S5561051A
Authority
JP
Japan
Prior art keywords
lead wire
jigs
fitting
grooves
guard rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13317678A
Other languages
Japanese (ja)
Inventor
Katsuhiro Kusumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13317678A priority Critical patent/JPS5561051A/en
Publication of JPS5561051A publication Critical patent/JPS5561051A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To make lead wires ready for correcting deformations perfectly by a simple device.
CONSTITUTION: A deformed lead wire 3 is nearly arrayed on the face vertical to a main surface Z1 of a stem from inserting it in grooves 54, 55 of a guard rail. Next, an electronic part 1 is shifted until it comes to a given position on a fitting 6. The fitting 6 has an interval covering the grooves 54, 55. Next, an air cylinder 7 is actuated to catch the lead wire 3 in jigs 16, 17 arranged on the end of a pair of slidable blocks 14, 15. The lead wire 3 is squeezed and shaped by operating the jigs 16, 17 downward with the air cylinder 18. The air in the cylinders 7, 18 is then extracted to raise a supporting plate 19, the jigs 16, 17 are released from catching, and thus the lead wire is shifted to the guard rail 5 lacking a guide part 53. The deformed lead can now be corrected perfectly by the above simple device.
COPYRIGHT: (C)1980,JPO&Japio
JP13317678A 1978-10-31 1978-10-31 Method and device for correcting lead wire of electronic parts Pending JPS5561051A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13317678A JPS5561051A (en) 1978-10-31 1978-10-31 Method and device for correcting lead wire of electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13317678A JPS5561051A (en) 1978-10-31 1978-10-31 Method and device for correcting lead wire of electronic parts

Publications (1)

Publication Number Publication Date
JPS5561051A true JPS5561051A (en) 1980-05-08

Family

ID=15098445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13317678A Pending JPS5561051A (en) 1978-10-31 1978-10-31 Method and device for correcting lead wire of electronic parts

Country Status (1)

Country Link
JP (1) JPS5561051A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618879A (en) * 1983-04-20 1986-10-21 Fujitsu Limited Semiconductor device having adjacent bonding wires extending at different angles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618879A (en) * 1983-04-20 1986-10-21 Fujitsu Limited Semiconductor device having adjacent bonding wires extending at different angles

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