JPS5561051A - Method and device for correcting lead wire of electronic parts - Google Patents
Method and device for correcting lead wire of electronic partsInfo
- Publication number
- JPS5561051A JPS5561051A JP13317678A JP13317678A JPS5561051A JP S5561051 A JPS5561051 A JP S5561051A JP 13317678 A JP13317678 A JP 13317678A JP 13317678 A JP13317678 A JP 13317678A JP S5561051 A JPS5561051 A JP S5561051A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- jigs
- fitting
- grooves
- guard rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To make lead wires ready for correcting deformations perfectly by a simple device.
CONSTITUTION: A deformed lead wire 3 is nearly arrayed on the face vertical to a main surface Z1 of a stem from inserting it in grooves 54, 55 of a guard rail. Next, an electronic part 1 is shifted until it comes to a given position on a fitting 6. The fitting 6 has an interval covering the grooves 54, 55. Next, an air cylinder 7 is actuated to catch the lead wire 3 in jigs 16, 17 arranged on the end of a pair of slidable blocks 14, 15. The lead wire 3 is squeezed and shaped by operating the jigs 16, 17 downward with the air cylinder 18. The air in the cylinders 7, 18 is then extracted to raise a supporting plate 19, the jigs 16, 17 are released from catching, and thus the lead wire is shifted to the guard rail 5 lacking a guide part 53. The deformed lead can now be corrected perfectly by the above simple device.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13317678A JPS5561051A (en) | 1978-10-31 | 1978-10-31 | Method and device for correcting lead wire of electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13317678A JPS5561051A (en) | 1978-10-31 | 1978-10-31 | Method and device for correcting lead wire of electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5561051A true JPS5561051A (en) | 1980-05-08 |
Family
ID=15098445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13317678A Pending JPS5561051A (en) | 1978-10-31 | 1978-10-31 | Method and device for correcting lead wire of electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5561051A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4618879A (en) * | 1983-04-20 | 1986-10-21 | Fujitsu Limited | Semiconductor device having adjacent bonding wires extending at different angles |
-
1978
- 1978-10-31 JP JP13317678A patent/JPS5561051A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4618879A (en) * | 1983-04-20 | 1986-10-21 | Fujitsu Limited | Semiconductor device having adjacent bonding wires extending at different angles |
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