JPS5552249A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5552249A
JPS5552249A JP12552178A JP12552178A JPS5552249A JP S5552249 A JPS5552249 A JP S5552249A JP 12552178 A JP12552178 A JP 12552178A JP 12552178 A JP12552178 A JP 12552178A JP S5552249 A JPS5552249 A JP S5552249A
Authority
JP
Japan
Prior art keywords
cooling
wind tunnel
semiconductor element
iron core
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12552178A
Other languages
Japanese (ja)
Inventor
Seiichi Igarashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12552178A priority Critical patent/JPS5552249A/en
Publication of JPS5552249A publication Critical patent/JPS5552249A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Power Conversion In General (AREA)

Abstract

PURPOSE:To provide a semiconductor device which is miniaturized in size by arranging a member of controlling the di/dt values on the periphery of a semiconductor element and yet inside a cooling wind tunnel so that both the control member and the semiconductor element are cooled at the same time within the common cooling device wind tunnel. CONSTITUTION:In power rectifiers, inverters, switches, breakers, and the like, a flat type semiconductor element 1 is additionally equipped, for example, with a cylindrically shaped core 2 made of iron to produce inductance so that the transient di/dt values of the semiconductor element 1 may be controlled. A cooling fin 4 is fitted to both electrodes of the element 1, with the iron core 2 provided between the periphery of the element 1 and the cooling fin 4. The thus formed composite is placed within a wind tunnel 9 to be cooled, using a cooling fan 6. The iron core tends to become exothermic by hysteresis loss, but since it is situated near to the element 1 within the wind tunnel 9, no extra cooling means to be used exclusively for cooling the iron core may be required any longer. This is why the semiconductor device can be made smaller sized.
JP12552178A 1978-10-12 1978-10-12 Semiconductor device Pending JPS5552249A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12552178A JPS5552249A (en) 1978-10-12 1978-10-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12552178A JPS5552249A (en) 1978-10-12 1978-10-12 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5552249A true JPS5552249A (en) 1980-04-16

Family

ID=14912205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12552178A Pending JPS5552249A (en) 1978-10-12 1978-10-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5552249A (en)

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