JPS5550464A - Electron beam evaporation apparatus - Google Patents

Electron beam evaporation apparatus

Info

Publication number
JPS5550464A
JPS5550464A JP12301178A JP12301178A JPS5550464A JP S5550464 A JPS5550464 A JP S5550464A JP 12301178 A JP12301178 A JP 12301178A JP 12301178 A JP12301178 A JP 12301178A JP S5550464 A JPS5550464 A JP S5550464A
Authority
JP
Japan
Prior art keywords
liner
electron beam
upper face
easy
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12301178A
Other languages
Japanese (ja)
Other versions
JPS5814875B2 (en
Inventor
Kikuo Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jeol Ltd
Original Assignee
Jeol Ltd
Nihon Denshi KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeol Ltd, Nihon Denshi KK filed Critical Jeol Ltd
Priority to JP12301178A priority Critical patent/JPS5814875B2/en
Publication of JPS5550464A publication Critical patent/JPS5550464A/en
Publication of JPS5814875B2 publication Critical patent/JPS5814875B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:Electron beam evaporation apparatus, forming only central part of liner by the material easy to wet against needlewire-shaped evaporation material drawing out from central passing hole of the liner and melting by electron beam irradiation and making easy to form a small ball of evaporation material on the liner. CONSTITUTION:The needlewire-shaped evaporation material 11 is sent out in the arrow mark direction 12 at a constant speed from the passing hole 10 provided penetrating the liner 8 and the water cooling holder 9. Then, shock is given on the upper face of the liner 8 and tip of the material 11 by the electron beam 15 and both parts are melted by heating. On this occasion, for example, when the material 11 is made of Cu, the central part material 13 of the liner 8, is formed by Mo etc. being easy to wet against copper and the ring 14 made of graphite etc. being difficult to wet against copper, is put in around the material 13. As a result, the upper face of the material 13 is wetted by the melted material 11, but the material 11 is not spread over the ring 14 and a small ball is formed swelling on the upper face of the material 13.
JP12301178A 1978-10-05 1978-10-05 Electron beam evaporation device Expired JPS5814875B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12301178A JPS5814875B2 (en) 1978-10-05 1978-10-05 Electron beam evaporation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12301178A JPS5814875B2 (en) 1978-10-05 1978-10-05 Electron beam evaporation device

Publications (2)

Publication Number Publication Date
JPS5550464A true JPS5550464A (en) 1980-04-12
JPS5814875B2 JPS5814875B2 (en) 1983-03-22

Family

ID=14850025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12301178A Expired JPS5814875B2 (en) 1978-10-05 1978-10-05 Electron beam evaporation device

Country Status (1)

Country Link
JP (1) JPS5814875B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59162947U (en) * 1983-04-18 1984-10-31 株式会社トキメック centrifuge separator

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102438823B1 (en) 2016-05-09 2022-08-31 삼성에스디에스 주식회사 Method and Apparatus for executing function for plural items on list

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59162947U (en) * 1983-04-18 1984-10-31 株式会社トキメック centrifuge separator

Also Published As

Publication number Publication date
JPS5814875B2 (en) 1983-03-22

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