JPS5550221A - Forming method for corrosion resistant transparent conductive film - Google Patents

Forming method for corrosion resistant transparent conductive film

Info

Publication number
JPS5550221A
JPS5550221A JP12431678A JP12431678A JPS5550221A JP S5550221 A JPS5550221 A JP S5550221A JP 12431678 A JP12431678 A JP 12431678A JP 12431678 A JP12431678 A JP 12431678A JP S5550221 A JPS5550221 A JP S5550221A
Authority
JP
Japan
Prior art keywords
conductive film
transparent conductive
resistance value
resistant transparent
ta2o5
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12431678A
Other languages
Japanese (ja)
Other versions
JPS5923404B2 (en
Inventor
Noboru Kuriyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuda Seisakusho Co Ltd
Original Assignee
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuda Seisakusho Co Ltd filed Critical Tokuda Seisakusho Co Ltd
Priority to JP12431678A priority Critical patent/JPS5923404B2/en
Publication of JPS5550221A publication Critical patent/JPS5550221A/en
Publication of JPS5923404B2 publication Critical patent/JPS5923404B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Liquid Crystal (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Surface Treatment Of Glass (AREA)
  • Physical Vapour Deposition (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

PURPOSE:To obtain the good corrosion resistant transparent conductive film of low resistance value by sputtering the material comprising Ta2O5 at 1-10wt% to TiO2 in the atmosphere added with O2 so as to have a partial pressure of 0.1-10% in Ar gas. CONSTITUTION:The material comprising adding Ta2O5 at 1-10wt% (about 6wt% to obtain the lowest resistance value) to TiO2 is used as a target material. This material is sputtered in an atmosphere comprising adding O2 to Ar gas so as to have a partial pressure of 1 to 0.1-10% (about 4% in order to obtain the minimum resistance value), whereby the corrosion-resistant transparent conductive film is obtained. In this way, the high resistance value, poor reproducibility and difficulty in practiable use in the case of TiO2 alone are solved by addition of Ta2O5 and the conductive film of superior corrosion resistance and heat resistance used for liquid crystal display device, etc. is obtained.
JP12431678A 1978-10-09 1978-10-09 Corrosion-resistant transparent conductive film formation method Expired JPS5923404B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12431678A JPS5923404B2 (en) 1978-10-09 1978-10-09 Corrosion-resistant transparent conductive film formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12431678A JPS5923404B2 (en) 1978-10-09 1978-10-09 Corrosion-resistant transparent conductive film formation method

Publications (2)

Publication Number Publication Date
JPS5550221A true JPS5550221A (en) 1980-04-11
JPS5923404B2 JPS5923404B2 (en) 1984-06-01

Family

ID=14882304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12431678A Expired JPS5923404B2 (en) 1978-10-09 1978-10-09 Corrosion-resistant transparent conductive film formation method

Country Status (1)

Country Link
JP (1) JPS5923404B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6145645U (en) * 1984-08-30 1986-03-26 臼井国際産業株式会社 Torsional vibration damper
JPH0160054U (en) * 1987-10-12 1989-04-17
JPH0519700U (en) * 1991-08-28 1993-03-12 株式会社フコク damper
WO2002082474A1 (en) * 2001-04-09 2002-10-17 Vishay Dale Electronics, Inc. Thin film resistor having tantalum pentoxide moisture barrier
WO2009119273A1 (en) * 2008-03-25 2009-10-01 旭硝子株式会社 Conductor and manufacturing method therefor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0797928B2 (en) * 1988-06-03 1995-10-25 井関農機株式会社 Rolling equipment for mobile farm work machines
JPH07114585B2 (en) * 1988-06-17 1995-12-13 井関農機株式会社 Horizontal control device for paddy farm machinery

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6145645U (en) * 1984-08-30 1986-03-26 臼井国際産業株式会社 Torsional vibration damper
JPH0160054U (en) * 1987-10-12 1989-04-17
JPH0519700U (en) * 1991-08-28 1993-03-12 株式会社フコク damper
WO2002082474A1 (en) * 2001-04-09 2002-10-17 Vishay Dale Electronics, Inc. Thin film resistor having tantalum pentoxide moisture barrier
US7170389B2 (en) 2001-04-09 2007-01-30 Vishay Dale Electronics, Inc. Apparatus for tantalum pentoxide moisture barrier in film resistors
US7214295B2 (en) 2001-04-09 2007-05-08 Vishay Dale Electronics, Inc. Method for tantalum pentoxide moisture barrier in film resistors
WO2009119273A1 (en) * 2008-03-25 2009-10-01 旭硝子株式会社 Conductor and manufacturing method therefor
JP2009231213A (en) * 2008-03-25 2009-10-08 Kanagawa Acad Of Sci & Technol Conductor and its manufacturing method

Also Published As

Publication number Publication date
JPS5923404B2 (en) 1984-06-01

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