JPS5548473B2 - - Google Patents
Info
- Publication number
- JPS5548473B2 JPS5548473B2 JP5571076A JP5571076A JPS5548473B2 JP S5548473 B2 JPS5548473 B2 JP S5548473B2 JP 5571076 A JP5571076 A JP 5571076A JP 5571076 A JP5571076 A JP 5571076A JP S5548473 B2 JPS5548473 B2 JP S5548473B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5571076A JPS52138669A (en) | 1976-05-15 | 1976-05-15 | Method of producing copper stacked board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5571076A JPS52138669A (en) | 1976-05-15 | 1976-05-15 | Method of producing copper stacked board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52138669A JPS52138669A (en) | 1977-11-18 |
JPS5548473B2 true JPS5548473B2 (it) | 1980-12-05 |
Family
ID=13006426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5571076A Granted JPS52138669A (en) | 1976-05-15 | 1976-05-15 | Method of producing copper stacked board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52138669A (it) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160070702A (ko) | 2014-12-10 | 2016-06-20 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 폴리머, 레지스트 재료 및 패턴 형성 방법 |
KR20160096549A (ko) | 2015-02-05 | 2016-08-16 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 폴리머, 레지스트 재료 및 패턴 형성 방법 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54155470A (en) * | 1978-05-30 | 1979-12-07 | Fujitsu Ltd | Method of producing multiilayer printed circuit board |
JPS58123797A (ja) * | 1982-01-18 | 1983-07-23 | 富士通株式会社 | 多層プリント配線板 |
JP6357788B2 (ja) * | 2014-02-10 | 2018-07-18 | 日立化成株式会社 | プリプレグ、金属張り積層板及び印刷配線板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4941857A (it) * | 1972-08-30 | 1974-04-19 | ||
JPS50128785A (it) * | 1974-03-30 | 1975-10-11 | ||
JPS50128786A (it) * | 1974-03-30 | 1975-10-11 |
-
1976
- 1976-05-15 JP JP5571076A patent/JPS52138669A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4941857A (it) * | 1972-08-30 | 1974-04-19 | ||
JPS50128785A (it) * | 1974-03-30 | 1975-10-11 | ||
JPS50128786A (it) * | 1974-03-30 | 1975-10-11 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160070702A (ko) | 2014-12-10 | 2016-06-20 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 폴리머, 레지스트 재료 및 패턴 형성 방법 |
KR20160096549A (ko) | 2015-02-05 | 2016-08-16 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 폴리머, 레지스트 재료 및 패턴 형성 방법 |
Also Published As
Publication number | Publication date |
---|---|
JPS52138669A (en) | 1977-11-18 |