JPS52138669A - Method of producing copper stacked board - Google Patents
Method of producing copper stacked boardInfo
- Publication number
- JPS52138669A JPS52138669A JP5571076A JP5571076A JPS52138669A JP S52138669 A JPS52138669 A JP S52138669A JP 5571076 A JP5571076 A JP 5571076A JP 5571076 A JP5571076 A JP 5571076A JP S52138669 A JPS52138669 A JP S52138669A
- Authority
- JP
- Japan
- Prior art keywords
- producing copper
- stacked board
- copper stacked
- board
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5571076A JPS52138669A (en) | 1976-05-15 | 1976-05-15 | Method of producing copper stacked board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5571076A JPS52138669A (en) | 1976-05-15 | 1976-05-15 | Method of producing copper stacked board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52138669A true JPS52138669A (en) | 1977-11-18 |
JPS5548473B2 JPS5548473B2 (en) | 1980-12-05 |
Family
ID=13006426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5571076A Granted JPS52138669A (en) | 1976-05-15 | 1976-05-15 | Method of producing copper stacked board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52138669A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54155470A (en) * | 1978-05-30 | 1979-12-07 | Fujitsu Ltd | Method of producing multiilayer printed circuit board |
JPS58123797A (en) * | 1982-01-18 | 1983-07-23 | 富士通株式会社 | Multilayer printed circuit board |
JP2015147912A (en) * | 2014-02-10 | 2015-08-20 | 日立化成株式会社 | Prepreg, metal-clad laminate, and printed wiring board |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016108508A (en) | 2014-12-10 | 2016-06-20 | 信越化学工業株式会社 | Polymer, resist material, and pattern formation method |
JP2016141796A (en) | 2015-02-05 | 2016-08-08 | 信越化学工業株式会社 | Polymer, resist material, and patterning process |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4941857A (en) * | 1972-08-30 | 1974-04-19 | ||
JPS50128785A (en) * | 1974-03-30 | 1975-10-11 | ||
JPS50128786A (en) * | 1974-03-30 | 1975-10-11 |
-
1976
- 1976-05-15 JP JP5571076A patent/JPS52138669A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4941857A (en) * | 1972-08-30 | 1974-04-19 | ||
JPS50128785A (en) * | 1974-03-30 | 1975-10-11 | ||
JPS50128786A (en) * | 1974-03-30 | 1975-10-11 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54155470A (en) * | 1978-05-30 | 1979-12-07 | Fujitsu Ltd | Method of producing multiilayer printed circuit board |
JPS58123797A (en) * | 1982-01-18 | 1983-07-23 | 富士通株式会社 | Multilayer printed circuit board |
JP2015147912A (en) * | 2014-02-10 | 2015-08-20 | 日立化成株式会社 | Prepreg, metal-clad laminate, and printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
JPS5548473B2 (en) | 1980-12-05 |
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