JPS5544453B2 - - Google Patents
Info
- Publication number
- JPS5544453B2 JPS5544453B2 JP10828175A JP10828175A JPS5544453B2 JP S5544453 B2 JPS5544453 B2 JP S5544453B2 JP 10828175 A JP10828175 A JP 10828175A JP 10828175 A JP10828175 A JP 10828175A JP S5544453 B2 JPS5544453 B2 JP S5544453B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10828175A JPS5231673A (en) | 1975-09-04 | 1975-09-04 | Resin sealing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10828175A JPS5231673A (en) | 1975-09-04 | 1975-09-04 | Resin sealing method of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5231673A JPS5231673A (en) | 1977-03-10 |
| JPS5544453B2 true JPS5544453B2 (es) | 1980-11-12 |
Family
ID=14480658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10828175A Granted JPS5231673A (en) | 1975-09-04 | 1975-09-04 | Resin sealing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5231673A (es) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53141578A (en) * | 1977-05-16 | 1978-12-09 | Fuji Electric Co Ltd | Glass-slurry applying device |
| BE1002529A6 (nl) * | 1988-09-27 | 1991-03-12 | Bell Telephone Mfg | Methode om een elektronische component te monteren en geheugen kaart waarin deze wordt toegepast. |
| JPH0378234A (ja) * | 1989-08-21 | 1991-04-03 | Rohm Co Ltd | 半導体装置の製造方法 |
| US5120678A (en) * | 1990-11-05 | 1992-06-09 | Motorola Inc. | Electrical component package comprising polymer-reinforced solder bump interconnection |
| US5508888A (en) * | 1994-05-09 | 1996-04-16 | At&T Global Information Solutions Company | Electronic component lead protector |
-
1975
- 1975-09-04 JP JP10828175A patent/JPS5231673A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5231673A (en) | 1977-03-10 |