JPS5540026A - Solderable anodized film aluminum wire - Google Patents
Solderable anodized film aluminum wireInfo
- Publication number
- JPS5540026A JPS5540026A JP11148678A JP11148678A JPS5540026A JP S5540026 A JPS5540026 A JP S5540026A JP 11148678 A JP11148678 A JP 11148678A JP 11148678 A JP11148678 A JP 11148678A JP S5540026 A JPS5540026 A JP S5540026A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- layer
- aluminum
- solderable
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrochemical Coating By Surface Reaction (AREA)
- Insulated Conductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11148678A JPS5540026A (en) | 1978-09-11 | 1978-09-11 | Solderable anodized film aluminum wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11148678A JPS5540026A (en) | 1978-09-11 | 1978-09-11 | Solderable anodized film aluminum wire |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5540026A true JPS5540026A (en) | 1980-03-21 |
JPS6137359B2 JPS6137359B2 (enrdf_load_stackoverflow) | 1986-08-23 |
Family
ID=14562480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11148678A Granted JPS5540026A (en) | 1978-09-11 | 1978-09-11 | Solderable anodized film aluminum wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5540026A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6167985U (enrdf_load_stackoverflow) * | 1984-10-11 | 1986-05-09 | ||
JPS6167984U (enrdf_load_stackoverflow) * | 1984-10-11 | 1986-05-09 | ||
WO1998052772A1 (fr) * | 1997-05-19 | 1998-11-26 | Hitachi Maxell, Ltd. | Module de circuit integre flexible et son procede de production, procede de production de support d'information comprenant ledit module |
CN1075451C (zh) * | 1997-05-19 | 2001-11-28 | 日立马库塞鲁株式会社 | 柔性信用卡模块及其制造方法以及使用柔性信用卡模块制造信息载体的方法 |
KR100375636B1 (ko) * | 2000-07-04 | 2003-03-15 | 주식회사 일 진 | 동복알루미늄선의 제조 방법 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6359973U (enrdf_load_stackoverflow) * | 1986-10-08 | 1988-04-21 |
-
1978
- 1978-09-11 JP JP11148678A patent/JPS5540026A/ja active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6167985U (enrdf_load_stackoverflow) * | 1984-10-11 | 1986-05-09 | ||
JPS6167984U (enrdf_load_stackoverflow) * | 1984-10-11 | 1986-05-09 | ||
WO1998052772A1 (fr) * | 1997-05-19 | 1998-11-26 | Hitachi Maxell, Ltd. | Module de circuit integre flexible et son procede de production, procede de production de support d'information comprenant ledit module |
CN1075451C (zh) * | 1997-05-19 | 2001-11-28 | 日立马库塞鲁株式会社 | 柔性信用卡模块及其制造方法以及使用柔性信用卡模块制造信息载体的方法 |
US6412701B1 (en) | 1997-05-19 | 2002-07-02 | Hitachi Maxell, Ltd. | Flexible IC module and method of its manufacture, and method of manufacturing information carrier comprising flexible IC module |
KR100375636B1 (ko) * | 2000-07-04 | 2003-03-15 | 주식회사 일 진 | 동복알루미늄선의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
JPS6137359B2 (enrdf_load_stackoverflow) | 1986-08-23 |
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