JPS5531140A - Pretreatment method of brazing filler metal substrate for electroforming - Google Patents
Pretreatment method of brazing filler metal substrate for electroformingInfo
- Publication number
- JPS5531140A JPS5531140A JP10365478A JP10365478A JPS5531140A JP S5531140 A JPS5531140 A JP S5531140A JP 10365478 A JP10365478 A JP 10365478A JP 10365478 A JP10365478 A JP 10365478A JP S5531140 A JPS5531140 A JP S5531140A
- Authority
- JP
- Japan
- Prior art keywords
- brazing filler
- filler metal
- solution containing
- substrate
- electroforming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title abstract 6
- 239000000945 filler Substances 0.000 title abstract 6
- 229910052751 metal Inorganic materials 0.000 title abstract 6
- 239000002184 metal Substances 0.000 title abstract 6
- 239000000758 substrate Substances 0.000 title abstract 6
- 238000005323 electroforming Methods 0.000 title abstract 3
- 238000002203 pretreatment Methods 0.000 title 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 abstract 3
- 239000010408 film Substances 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 abstract 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000004372 Polyvinyl alcohol Substances 0.000 abstract 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 abstract 1
- 230000003213 activating effect Effects 0.000 abstract 1
- 230000001464 adherent effect Effects 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000005034 decoration Methods 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 238000007772 electroless plating Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 150000002736 metal compounds Chemical class 0.000 abstract 1
- 229910000510 noble metal Inorganic materials 0.000 abstract 1
- 229920002451 polyvinyl alcohol Polymers 0.000 abstract 1
- 235000011150 stannous chloride Nutrition 0.000 abstract 1
- 239000001119 stannous chloride Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10365478A JPS5531140A (en) | 1978-08-25 | 1978-08-25 | Pretreatment method of brazing filler metal substrate for electroforming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10365478A JPS5531140A (en) | 1978-08-25 | 1978-08-25 | Pretreatment method of brazing filler metal substrate for electroforming |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5531140A true JPS5531140A (en) | 1980-03-05 |
| JPS6250558B2 JPS6250558B2 (enrdf_load_stackoverflow) | 1987-10-26 |
Family
ID=14359759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10365478A Granted JPS5531140A (en) | 1978-08-25 | 1978-08-25 | Pretreatment method of brazing filler metal substrate for electroforming |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5531140A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100406433B1 (ko) * | 1999-10-12 | 2003-11-19 | 주식회사 포스코 | 자동차외판용 이종도금강판에 전도성 고분자화합물을 피복하는 방법 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0240371U (enrdf_load_stackoverflow) * | 1988-09-09 | 1990-03-19 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52142774A (en) * | 1976-05-25 | 1977-11-28 | Yutaka Hosokawa | Plating |
-
1978
- 1978-08-25 JP JP10365478A patent/JPS5531140A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52142774A (en) * | 1976-05-25 | 1977-11-28 | Yutaka Hosokawa | Plating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100406433B1 (ko) * | 1999-10-12 | 2003-11-19 | 주식회사 포스코 | 자동차외판용 이종도금강판에 전도성 고분자화합물을 피복하는 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6250558B2 (enrdf_load_stackoverflow) | 1987-10-26 |
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