JPS5530952A - Manufacturing of insulation substrate having the copper- lined - Google Patents

Manufacturing of insulation substrate having the copper- lined

Info

Publication number
JPS5530952A
JPS5530952A JP10442978A JP10442978A JPS5530952A JP S5530952 A JPS5530952 A JP S5530952A JP 10442978 A JP10442978 A JP 10442978A JP 10442978 A JP10442978 A JP 10442978A JP S5530952 A JPS5530952 A JP S5530952A
Authority
JP
Japan
Prior art keywords
percent
hardening
resin
surrounding frame
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10442978A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6226292B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Shiba
Katsuhiro Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Graphite Industries Ltd
Original Assignee
Nippon Graphite Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Graphite Industries Ltd filed Critical Nippon Graphite Industries Ltd
Priority to JP10442978A priority Critical patent/JPS5530952A/ja
Publication of JPS5530952A publication Critical patent/JPS5530952A/ja
Publication of JPS6226292B2 publication Critical patent/JPS6226292B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP10442978A 1978-08-29 1978-08-29 Manufacturing of insulation substrate having the copper- lined Granted JPS5530952A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10442978A JPS5530952A (en) 1978-08-29 1978-08-29 Manufacturing of insulation substrate having the copper- lined

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10442978A JPS5530952A (en) 1978-08-29 1978-08-29 Manufacturing of insulation substrate having the copper- lined

Publications (2)

Publication Number Publication Date
JPS5530952A true JPS5530952A (en) 1980-03-05
JPS6226292B2 JPS6226292B2 (enrdf_load_stackoverflow) 1987-06-08

Family

ID=14380426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10442978A Granted JPS5530952A (en) 1978-08-29 1978-08-29 Manufacturing of insulation substrate having the copper- lined

Country Status (1)

Country Link
JP (1) JPS5530952A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4985747A (en) * 1988-06-09 1991-01-15 Oki Electric Industry Co., Ltd. Terminal structure and process of fabricating the same
WO2012151422A1 (en) * 2011-05-03 2012-11-08 Innovalight Inc Ceramic boron-containing doping paste and methods therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4985747A (en) * 1988-06-09 1991-01-15 Oki Electric Industry Co., Ltd. Terminal structure and process of fabricating the same
WO2012151422A1 (en) * 2011-05-03 2012-11-08 Innovalight Inc Ceramic boron-containing doping paste and methods therefor
CN103649011A (zh) * 2011-05-03 2014-03-19 英诺瓦莱特公司 陶瓷含硼掺杂浆料及其制备方法

Also Published As

Publication number Publication date
JPS6226292B2 (enrdf_load_stackoverflow) 1987-06-08

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