JPS5530289B2 - - Google Patents

Info

Publication number
JPS5530289B2
JPS5530289B2 JP1678975A JP1678975A JPS5530289B2 JP S5530289 B2 JPS5530289 B2 JP S5530289B2 JP 1678975 A JP1678975 A JP 1678975A JP 1678975 A JP1678975 A JP 1678975A JP S5530289 B2 JPS5530289 B2 JP S5530289B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1678975A
Other languages
Japanese (ja)
Other versions
JPS50110073A (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50110073A publication Critical patent/JPS50110073A/ja
Publication of JPS5530289B2 publication Critical patent/JPS5530289B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/26—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials
    • H10P50/262—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by physical means only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP1678975A 1974-02-12 1975-02-08 Expired JPS5530289B2 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7401859A NL7401859A (nl) 1974-02-12 1974-02-12 Werkwijze voor het vervaardigen van een patroon en of meer lagen op een ondergrond door selijk verwijderen van deze laag of lagen sputteretsen en voorwerpen, in het bijzon- alfgeleiderinrichtingen, vervaardigd met ssing van deze werkwijze.

Publications (2)

Publication Number Publication Date
JPS50110073A JPS50110073A (cg-RX-API-DMAC7.html) 1975-08-29
JPS5530289B2 true JPS5530289B2 (cg-RX-API-DMAC7.html) 1980-08-09

Family

ID=19820730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1678975A Expired JPS5530289B2 (cg-RX-API-DMAC7.html) 1974-02-12 1975-02-08

Country Status (6)

Country Link
US (1) US3984300A (cg-RX-API-DMAC7.html)
JP (1) JPS5530289B2 (cg-RX-API-DMAC7.html)
DE (1) DE2504500A1 (cg-RX-API-DMAC7.html)
FR (1) FR2260451B1 (cg-RX-API-DMAC7.html)
GB (1) GB1491746A (cg-RX-API-DMAC7.html)
NL (1) NL7401859A (cg-RX-API-DMAC7.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057831A (en) * 1972-09-05 1977-11-08 U.S. Philips Corporation Video record disc manufactured by a process involving chemical or sputter etching
DE2536718C3 (de) * 1975-08-18 1978-04-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung geätzter Strukturen in Festkörperoberflächen durch Ionenätzung und Bestrahlungsmaske zur Verwendung in diesem Verfahren
US4057460A (en) * 1976-11-22 1977-11-08 Data General Corporation Plasma etching process
DE2754526C2 (de) * 1977-12-07 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung des Kathodensystems eines Röntgen- oder Gammastrahlenkonverters
JPS5496775A (en) * 1978-01-17 1979-07-31 Hitachi Ltd Method of forming circuit
US4340276A (en) 1978-11-01 1982-07-20 Minnesota Mining And Manufacturing Company Method of producing a microstructured surface and the article produced thereby
JPS57157523A (en) * 1981-03-25 1982-09-29 Hitachi Ltd Forming method for pattern
US4375390A (en) * 1982-03-15 1983-03-01 Anderson Nathaniel C Thin film techniques for fabricating narrow track ferrite heads
GB2148769A (en) * 1983-10-22 1985-06-05 Standard Telephones Cables Ltd Topographic feature formation by ion beam milling of a substrate
DE3534418A1 (de) * 1985-09-27 1987-04-02 Telefunken Electronic Gmbh Verfahren zum herstellen von vertiefungen in einem halbleiterbauelemente enthaltenden halbleiterkoerper
US4767418A (en) * 1986-02-13 1988-08-30 California Institute Of Technology Luminal surface fabrication for cardiovascular prostheses
US5139974A (en) * 1991-01-25 1992-08-18 Micron Technology, Inc. Semiconductor manufacturing process for decreasing the optical refelctivity of a metal layer

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3400066A (en) * 1965-11-15 1968-09-03 Ibm Sputtering processes for depositing thin films of controlled thickness
US3436327A (en) * 1966-07-18 1969-04-01 Collins Radio Co Selective sputtering rate circuit forming process
US3649503A (en) * 1969-12-03 1972-03-14 Motorola Inc Sputter etch mask
US3676317A (en) * 1970-10-23 1972-07-11 Stromberg Datagraphix Inc Sputter etching process
US3791952A (en) * 1972-07-24 1974-02-12 Bell Telephone Labor Inc Method for neutralizing charge in semiconductor bodies and dielectric coatings induced by cathodic etching

Also Published As

Publication number Publication date
FR2260451A1 (cg-RX-API-DMAC7.html) 1975-09-05
JPS50110073A (cg-RX-API-DMAC7.html) 1975-08-29
DE2504500A1 (de) 1975-08-14
FR2260451B1 (cg-RX-API-DMAC7.html) 1980-03-21
GB1491746A (en) 1977-11-16
NL7401859A (nl) 1975-08-14
US3984300A (en) 1976-10-05

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