JPS5524726A - Soldering mechanism with face profiling mechanism - Google Patents
Soldering mechanism with face profiling mechanismInfo
- Publication number
- JPS5524726A JPS5524726A JP9695878A JP9695878A JPS5524726A JP S5524726 A JPS5524726 A JP S5524726A JP 9695878 A JP9695878 A JP 9695878A JP 9695878 A JP9695878 A JP 9695878A JP S5524726 A JPS5524726 A JP S5524726A
- Authority
- JP
- Japan
- Prior art keywords
- tip
- lead
- descent
- descend
- brought
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9695878A JPS5524726A (en) | 1978-08-09 | 1978-08-09 | Soldering mechanism with face profiling mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9695878A JPS5524726A (en) | 1978-08-09 | 1978-08-09 | Soldering mechanism with face profiling mechanism |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5524726A true JPS5524726A (en) | 1980-02-22 |
JPS5632072B2 JPS5632072B2 (enrdf_load_stackoverflow) | 1981-07-25 |
Family
ID=14178765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9695878A Granted JPS5524726A (en) | 1978-08-09 | 1978-08-09 | Soldering mechanism with face profiling mechanism |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5524726A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4720035A (en) * | 1986-01-17 | 1988-01-19 | Fujitsu Limited | Method of reflow bonding electronic parts on printed circuit board and apparatus used therefor |
US4735354A (en) * | 1986-09-19 | 1988-04-05 | Toyo Electronics Corp. | Method of soldering component on printed circuit board |
JPH02169178A (ja) * | 1988-10-24 | 1990-06-29 | Hughes Aircraft Co | ヒータ棒装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0185271U (enrdf_load_stackoverflow) * | 1987-11-28 | 1989-06-06 |
-
1978
- 1978-08-09 JP JP9695878A patent/JPS5524726A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4720035A (en) * | 1986-01-17 | 1988-01-19 | Fujitsu Limited | Method of reflow bonding electronic parts on printed circuit board and apparatus used therefor |
US4735354A (en) * | 1986-09-19 | 1988-04-05 | Toyo Electronics Corp. | Method of soldering component on printed circuit board |
JPH02169178A (ja) * | 1988-10-24 | 1990-06-29 | Hughes Aircraft Co | ヒータ棒装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS5632072B2 (enrdf_load_stackoverflow) | 1981-07-25 |
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