JPS55164272A - Preparation of sheet adhesive and its device - Google Patents

Preparation of sheet adhesive and its device

Info

Publication number
JPS55164272A
JPS55164272A JP7203679A JP7203679A JPS55164272A JP S55164272 A JPS55164272 A JP S55164272A JP 7203679 A JP7203679 A JP 7203679A JP 7203679 A JP7203679 A JP 7203679A JP S55164272 A JPS55164272 A JP S55164272A
Authority
JP
Japan
Prior art keywords
roll
composition
softened
substrate
nip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7203679A
Other languages
Japanese (ja)
Other versions
JPS6053076B2 (en
Inventor
Hideo Watanabe
Tadashi Hayashida
Keiji Iwai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama Rubber Co Ltd
Hirano Steel Recycle Co
Original Assignee
Yokohama Rubber Co Ltd
Hirano Steel Recycle Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokohama Rubber Co Ltd, Hirano Steel Recycle Co filed Critical Yokohama Rubber Co Ltd
Priority to JP7203679A priority Critical patent/JPS6053076B2/en
Publication of JPS55164272A publication Critical patent/JPS55164272A/en
Publication of JPS6053076B2 publication Critical patent/JPS6053076B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a sheet adhesive without using a harmful solvent, by applying a thermosetting adhesive composition which is softened to such an extent as not to harden to a releasable material, and by impregnating the composition into a substrate (base material) between a heating roll and a nip roll.
CONSTITUTION: The thermosetting adhesive composition 4, e.g. an epoxy resin, is softened to such an extent as not to harden. The softened composition 4 is fed to the heating jacket 15 and applied to the releasable material 1 between the roll coater 6 and the coating roll 5. The coated material 1 is fed to the gap between the heating roll 8 and the nip roll 9, and heated with the saturable substrate (base material) 3, e.g. a nonwoven fabric, and the releasable liner 2 while being transferred by the rolls 8 and 9, to impregnate the composition 4 into the substrate 3 uniformly, and cooled by the roll 12 via the guide rolls 10 and 11. The material is then wound onto the roll 13; the product 21, onto the roll 4.
EFFECT: The product of any thickness can be obtained by adjusting the roll nip without inclusion of air bubbles.
COPYRIGHT: (C)1980,JPO&Japio
JP7203679A 1979-06-08 1979-06-08 Method and device for producing sheet adhesive Expired JPS6053076B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7203679A JPS6053076B2 (en) 1979-06-08 1979-06-08 Method and device for producing sheet adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7203679A JPS6053076B2 (en) 1979-06-08 1979-06-08 Method and device for producing sheet adhesive

Publications (2)

Publication Number Publication Date
JPS55164272A true JPS55164272A (en) 1980-12-20
JPS6053076B2 JPS6053076B2 (en) 1985-11-22

Family

ID=13477767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7203679A Expired JPS6053076B2 (en) 1979-06-08 1979-06-08 Method and device for producing sheet adhesive

Country Status (1)

Country Link
JP (1) JPS6053076B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01299884A (en) * 1988-05-28 1989-12-04 Tomoegawa Paper Co Ltd Die bonding adhesive tape
JP2002012833A (en) * 2000-06-30 2002-01-15 Hakko Co Ltd Automated process for impregnating substrate with adhesive and apparatus therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01299884A (en) * 1988-05-28 1989-12-04 Tomoegawa Paper Co Ltd Die bonding adhesive tape
JP2002012833A (en) * 2000-06-30 2002-01-15 Hakko Co Ltd Automated process for impregnating substrate with adhesive and apparatus therefor

Also Published As

Publication number Publication date
JPS6053076B2 (en) 1985-11-22

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