JPS5516413A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5516413A
JPS5516413A JP8842878A JP8842878A JPS5516413A JP S5516413 A JPS5516413 A JP S5516413A JP 8842878 A JP8842878 A JP 8842878A JP 8842878 A JP8842878 A JP 8842878A JP S5516413 A JPS5516413 A JP S5516413A
Authority
JP
Japan
Prior art keywords
substrate
sin film
oxide layer
film
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8842878A
Other languages
Japanese (ja)
Inventor
Shigeru Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8842878A priority Critical patent/JPS5516413A/en
Publication of JPS5516413A publication Critical patent/JPS5516413A/en
Pending legal-status Critical Current

Links

Landscapes

  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)

Abstract

PURPOSE: To prevent the formation of defects in a substrate and at the same time, to reduce the intrusion of a selective oxide layer into a lower portion of a mask by inserting a polycrystalline or non-crystalline film made up of the same material as that constituting a substrate as a buffer layer between a mask layer for selective oxidation and a semiconductor substrate.
CONSTITUTION: (a) Polycrystalline or non-crystalline Si 12 is deposited on a surface 11a of (100) crystal face P-type Si substrate 11 and then a SiN film 13 is deposited thereon. (b) Part of the SiN film is removed by use of a resist film 14 and at the areas of the substrate where the SiN film has been partly removed, B is ion-introduced in the surface of the substrate to prevent conversion in the field region (15A). (c) After the removal of the resist film, the SiN film 13A is masked and selectively oxidized to form an oxide layer 16. Under the field oxide layer 16, impurities in the ion-introduced region 15 are re-distributed, forming a p+-type reversion-preventing region 15.
COPYRIGHT: (C)1980,JPO&Japio
JP8842878A 1978-07-21 1978-07-21 Production of semiconductor device Pending JPS5516413A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8842878A JPS5516413A (en) 1978-07-21 1978-07-21 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8842878A JPS5516413A (en) 1978-07-21 1978-07-21 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5516413A true JPS5516413A (en) 1980-02-05

Family

ID=13942505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8842878A Pending JPS5516413A (en) 1978-07-21 1978-07-21 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5516413A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226466A (en) * 1992-02-10 1993-09-03 Nec Corp Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226466A (en) * 1992-02-10 1993-09-03 Nec Corp Manufacture of semiconductor device

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