JPS55155231A - Evaluation method of and apparatus for fatigue and rupture of soldered joint - Google Patents
Evaluation method of and apparatus for fatigue and rupture of soldered jointInfo
- Publication number
- JPS55155231A JPS55155231A JP6288679A JP6288679A JPS55155231A JP S55155231 A JPS55155231 A JP S55155231A JP 6288679 A JP6288679 A JP 6288679A JP 6288679 A JP6288679 A JP 6288679A JP S55155231 A JPS55155231 A JP S55155231A
- Authority
- JP
- Japan
- Prior art keywords
- rupture
- fatigue
- stress
- soldered joints
- recorder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
PURPOSE: To accomplish quick and highly accurate evaluation of the fatigue and rupture by detecting required information from the waves of stress produced corresponding to the fatigue and the rupture when mechanical stress is repeatedly applied on the soldered joints.
CONSTITUTION: When mechanical stress is repeatedly applied on the soldered joints between the substrate 1a fixed on the support plate 2 of the tensile tester and the lead wire, the magnitude of the stress is detected with the chuck 3, support rod 4 and load cell 5 and recorded on the recorder 22. Then, the wave of the stress produced corresponding to the fatigue and the rupture of the soldered joints is detected with a sensor 8 provided on the other end of the line 1b and processed with the Fourier analyzer 15 and the wave height distribution analyzing circuit 16. At the same time, it is processed with the counter circuit 23, the peak hole circuit 18, the effective voltmeter and the like. With the recording of the required information on the recorder 22 and indication thereof by the oscillascope 13 and the display 21, the fatigue and the rupture are evaluated quickly at a high accuracy.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6288679A JPS55155231A (en) | 1979-05-22 | 1979-05-22 | Evaluation method of and apparatus for fatigue and rupture of soldered joint |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6288679A JPS55155231A (en) | 1979-05-22 | 1979-05-22 | Evaluation method of and apparatus for fatigue and rupture of soldered joint |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55155231A true JPS55155231A (en) | 1980-12-03 |
Family
ID=13213181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6288679A Pending JPS55155231A (en) | 1979-05-22 | 1979-05-22 | Evaluation method of and apparatus for fatigue and rupture of soldered joint |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55155231A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6271829A (en) * | 1985-09-25 | 1987-04-02 | Mitsubishi Nuclear Fuel Co Ltd | Fatigue testing instrument for material |
JP2013076688A (en) * | 2011-09-29 | 2013-04-25 | Samsung Electro-Mechanics Co Ltd | Solder ball inspection device |
-
1979
- 1979-05-22 JP JP6288679A patent/JPS55155231A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6271829A (en) * | 1985-09-25 | 1987-04-02 | Mitsubishi Nuclear Fuel Co Ltd | Fatigue testing instrument for material |
JPH0457214B2 (en) * | 1985-09-25 | 1992-09-10 | Mitsubishi Genshi Nenryo Kk | |
JP2013076688A (en) * | 2011-09-29 | 2013-04-25 | Samsung Electro-Mechanics Co Ltd | Solder ball inspection device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2008413A6 (en) | Non destructive testing for creep damage of a ferromagnetic workpiece | |
EP0309956A3 (en) | Method of testing semiconductor elements and apparatus for testing the same | |
US3854328A (en) | Resiliency testing device | |
US4229693A (en) | Method and apparatus for capacitance testing printed circuit boards | |
CA2009901A1 (en) | Cathodic protection analyzer | |
CA1161114A (en) | Non-destructive testing method and apparatus for spot welds | |
JPS55155231A (en) | Evaluation method of and apparatus for fatigue and rupture of soldered joint | |
Lubert et al. | Force‐displacement evaluation of macromolecular materials in flexural impact tests. I. Apparatus and data handling | |
US3034340A (en) | Electrical crack measuring device for determining metal deterioration | |
JPH0612320B2 (en) | Device and method for evaluating mechanical properties of thin film | |
JPS564033A (en) | Method and device for automatically measuring tension sample | |
SU983501A1 (en) | Method of material extension testing | |
JPS62167409A (en) | Recording of measured value | |
JPS5590840A (en) | Method and device for measuring flexural rigidity of filament-like material | |
JP3335770B2 (en) | Evaluation method of scale peelability | |
JPS54112174A (en) | Testing method for semiconductor device | |
JPS55155230A (en) | Evaluation apparatus for fatigue and rupture of soldered joint | |
RU2200943C2 (en) | Method of estimation of crack-resistance of materials | |
JPS62501760A (en) | Method for determining the holding force characteristics of a device that holds processed products magnetically | |
CA2084277A1 (en) | Method and apparatus for determination of material residual stress | |
CHRESTIN et al. | Laser-optic measuring system for testing of materials[Final Report] | |
JPS6271829A (en) | Fatigue testing instrument for material | |
Seidl | Comparison of impact testing on Charpy V-notch specimens and WOL-1 X-specimens | |
JPS5242793A (en) | Self welding friction testing apparatus in liquid metal | |
JPS643555A (en) | Apparatus for inspecting deterioration of metallic material |