JPS55155020A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS55155020A JPS55155020A JP6320679A JP6320679A JPS55155020A JP S55155020 A JPS55155020 A JP S55155020A JP 6320679 A JP6320679 A JP 6320679A JP 6320679 A JP6320679 A JP 6320679A JP S55155020 A JPS55155020 A JP S55155020A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- bis
- hydroxy
- phenyl
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6320679A JPS55155020A (en) | 1979-05-24 | 1979-05-24 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6320679A JPS55155020A (en) | 1979-05-24 | 1979-05-24 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55155020A true JPS55155020A (en) | 1980-12-03 |
JPS6150968B2 JPS6150968B2 (ja) | 1986-11-06 |
Family
ID=13222489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6320679A Granted JPS55155020A (en) | 1979-05-24 | 1979-05-24 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55155020A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59232116A (ja) * | 1983-06-15 | 1984-12-26 | Matsushita Electronics Corp | 樹脂封止形半導体装置 |
CN102786903A (zh) * | 2012-06-26 | 2012-11-21 | 湖南柯盛新材料有限公司 | 一种石材复合用改性环氧胶粘剂及其制备方法 |
-
1979
- 1979-05-24 JP JP6320679A patent/JPS55155020A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59232116A (ja) * | 1983-06-15 | 1984-12-26 | Matsushita Electronics Corp | 樹脂封止形半導体装置 |
JPH0413372B2 (ja) * | 1983-06-15 | 1992-03-09 | Matsushita Electronics Corp | |
CN102786903A (zh) * | 2012-06-26 | 2012-11-21 | 湖南柯盛新材料有限公司 | 一种石材复合用改性环氧胶粘剂及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6150968B2 (ja) | 1986-11-06 |
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