JPS55152180A - Method for regeneration of copper chloride etching solution - Google Patents
Method for regeneration of copper chloride etching solutionInfo
- Publication number
- JPS55152180A JPS55152180A JP5923779A JP5923779A JPS55152180A JP S55152180 A JPS55152180 A JP S55152180A JP 5923779 A JP5923779 A JP 5923779A JP 5923779 A JP5923779 A JP 5923779A JP S55152180 A JPS55152180 A JP S55152180A
- Authority
- JP
- Japan
- Prior art keywords
- concentration
- etching solution
- copper
- etching
- measured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 title abstract 10
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 230000008929 regeneration Effects 0.000 title 1
- 238000011069 regeneration method Methods 0.000 title 1
- 239000010949 copper Substances 0.000 abstract 8
- 238000007254 oxidation reaction Methods 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 230000005484 gravity Effects 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 230000010287 polarization Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5923779A JPS55152180A (en) | 1979-05-14 | 1979-05-14 | Method for regeneration of copper chloride etching solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5923779A JPS55152180A (en) | 1979-05-14 | 1979-05-14 | Method for regeneration of copper chloride etching solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55152180A true JPS55152180A (en) | 1980-11-27 |
Family
ID=13107565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5923779A Pending JPS55152180A (en) | 1979-05-14 | 1979-05-14 | Method for regeneration of copper chloride etching solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55152180A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60122368U (ja) * | 1984-01-21 | 1985-08-17 | 小林 義和 | 塩化第二銅エツチング溶液の濃度管理装置 |
| US4696717A (en) * | 1984-10-19 | 1987-09-29 | International Business Machines Corporation | Process for automatically regenerating copper chloride etch solutions |
| JP2001348685A (ja) * | 2000-06-06 | 2001-12-18 | Yoshikazu Kobayashi | 塩化第二銅・塩素酸ナトリウム系エッチング液の管理システム |
| CN102953061A (zh) * | 2011-08-25 | 2013-03-06 | 成都虹华环保科技有限公司 | 应用于蚀刻液循环再生设备的自动添加系统 |
-
1979
- 1979-05-14 JP JP5923779A patent/JPS55152180A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60122368U (ja) * | 1984-01-21 | 1985-08-17 | 小林 義和 | 塩化第二銅エツチング溶液の濃度管理装置 |
| US4696717A (en) * | 1984-10-19 | 1987-09-29 | International Business Machines Corporation | Process for automatically regenerating copper chloride etch solutions |
| JP2001348685A (ja) * | 2000-06-06 | 2001-12-18 | Yoshikazu Kobayashi | 塩化第二銅・塩素酸ナトリウム系エッチング液の管理システム |
| CN102953061A (zh) * | 2011-08-25 | 2013-03-06 | 成都虹华环保科技有限公司 | 应用于蚀刻液循环再生设备的自动添加系统 |
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