JPS55150261A - Electric insulating supprt having low thermal resistance - Google Patents
Electric insulating supprt having low thermal resistanceInfo
- Publication number
- JPS55150261A JPS55150261A JP5854380A JP5854380A JPS55150261A JP S55150261 A JPS55150261 A JP S55150261A JP 5854380 A JP5854380 A JP 5854380A JP 5854380 A JP5854380 A JP 5854380A JP S55150261 A JPS55150261 A JP S55150261A
- Authority
- JP
- Japan
- Prior art keywords
- supprt
- thermal resistance
- low thermal
- electric insulating
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/122—Metallic interlayers based on refractory metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/407—Copper
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/64—Forming laminates or joined articles comprising grooves or cuts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T403/00—Joints and connections
- Y10T403/21—Utilizing thermal characteristic, e.g., expansion or contraction, etc.
- Y10T403/217—Members having different coefficients of expansion
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Ceramic Products (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7911023A FR2455785A1 (fr) | 1979-05-02 | 1979-05-02 | Support isolateur electrique, a faible resistance thermique, et embase ou boitier pour composant de puissance, comportant un tel support |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55150261A true JPS55150261A (en) | 1980-11-22 |
Family
ID=9224926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5854380A Pending JPS55150261A (en) | 1979-05-02 | 1980-04-30 | Electric insulating supprt having low thermal resistance |
Country Status (5)
Country | Link |
---|---|
US (1) | US4361720A (ja) |
EP (1) | EP0018890B1 (ja) |
JP (1) | JPS55150261A (ja) |
DE (1) | DE3061321D1 (ja) |
FR (1) | FR2455785A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4574162A (en) * | 1982-03-26 | 1986-03-04 | Kaufman Lance R | Compact circuit package with improved construction for clamping to enhance heat transfer |
JPS58170044A (ja) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | 半導体素子 |
CA1200326A (en) * | 1982-11-26 | 1986-02-04 | Franco N. Sechi | High-power dual-gate field-effect transistor |
FR2539249B1 (fr) * | 1983-01-07 | 1986-08-22 | Europ Composants Electron | Boitier a dissipation thermique elevee notamment pour microelectronique |
DE3315583A1 (de) * | 1983-04-29 | 1984-10-31 | Siemens AG, 1000 Berlin und 8000 München | Ein elektrisches bauteil tragendes, gut kuehlbares schaltungsmodul |
US4630096A (en) * | 1984-05-30 | 1986-12-16 | Motorola, Inc. | High density IC module assembly |
US4719631A (en) * | 1986-01-10 | 1988-01-12 | The United States Of America As Represented By The Secretary Of The Air Force | Conductively cooled laser diode array pumped laser |
US4788627A (en) * | 1986-06-06 | 1988-11-29 | Tektronix, Inc. | Heat sink device using composite metal alloy |
IT1201836B (it) * | 1986-07-17 | 1989-02-02 | Sgs Microelettronica Spa | Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico |
US5008492A (en) * | 1989-10-20 | 1991-04-16 | Hughes Aircraft Company | High current feedthrough package |
DE69009429T2 (de) * | 1989-12-29 | 1994-09-15 | Sumitomo Electric Industries | Kühlkörper mit verbesserter Lebensdauer und thermischer Leitfähigkeit. |
US5886407A (en) * | 1993-04-14 | 1999-03-23 | Frank J. Polese | Heat-dissipating package for microcircuit devices |
US5972737A (en) * | 1993-04-14 | 1999-10-26 | Frank J. Polese | Heat-dissipating package for microcircuit devices and process for manufacture |
US5886269A (en) * | 1995-02-17 | 1999-03-23 | Nippon Tungsten Co., Ltd. | Substrate and heat sink for a semiconductor and method of manufacturing the same |
DE69603664T2 (de) * | 1995-05-30 | 2000-03-16 | Motorola Inc | Hybrid-Multichip-Modul und Verfahren zur seiner Herstellung |
EP0935286A4 (en) * | 1997-05-26 | 2008-04-09 | Sumitomo Electric Industries | COPPER CIRCUIT JUNCTION SUBSTRATE AND PROCESS FOR PRODUCING THE SAME |
US8991680B1 (en) * | 2005-05-25 | 2015-03-31 | Alfred E. Mann Foundation For Scientific Research | Method of manufacture of an electrode array |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB873803A (en) * | 1959-05-29 | 1961-07-26 | Westinghouse Brake & Signal | Improvements in or relating to semi-conductor devices |
GB903824A (en) * | 1959-11-12 | 1962-08-22 | Ass Elect Ind | Improvements in ceramic-to-metal seals |
FR1372216A (fr) * | 1962-10-15 | 1964-09-11 | Asea Ab | Dispositif semi-conducteur |
FR1376243A (fr) * | 1963-12-04 | 1964-10-23 | Thomson Houston Comp Francaise | Perfectionnements aux scellements métal-céramique |
US4042952A (en) * | 1976-06-09 | 1977-08-16 | Motorola, Inc. | R. F. power transistor device with controlled common lead inductance |
US4227036A (en) * | 1978-09-18 | 1980-10-07 | Microwave Semiconductor Corp. | Composite flanged ceramic package for electronic devices |
JPS5550646A (en) * | 1978-10-06 | 1980-04-12 | Hitachi Ltd | Integrated circuit device |
-
1979
- 1979-05-02 FR FR7911023A patent/FR2455785A1/fr active Granted
-
1980
- 1980-04-23 EP EP80400549A patent/EP0018890B1/fr not_active Expired
- 1980-04-23 DE DE8080400549T patent/DE3061321D1/de not_active Expired
- 1980-04-30 US US06/145,023 patent/US4361720A/en not_active Expired - Lifetime
- 1980-04-30 JP JP5854380A patent/JPS55150261A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0018890B1 (fr) | 1982-12-15 |
FR2455785B1 (ja) | 1982-04-30 |
FR2455785A1 (fr) | 1980-11-28 |
DE3061321D1 (en) | 1983-01-20 |
EP0018890A1 (fr) | 1980-11-12 |
US4361720A (en) | 1982-11-30 |
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