JPS55149040A - Preparation of thin specimen - Google Patents

Abstract

PURPOSE:To obtain the thin specimen through mechanical polishing without giving any damage by inserting the specific thin glass plate between a polishing jig and the specimen to be polished and bonding these by means of two kinds of waxes of different melting points or the like in the manufacture of the thin specimen for a transmitting electron microscope. CONSTITUTION:The specimen 11 to be polished is bonded to the wide face side of a thin glass plate 61 which is cut obliquely at its edge 6 by mean of wax 63. Next, the thin plate 61 is bonded to a polishing jig 13 by means of wax 72. The wax 72 of a melting point lower than that of the wax 63 is used. After the specimen 11 surface is mechanically polished in this way, the jig 13 is heated to melt the wax 72 and the thin plat 61 is removed. Since the melting point of the wax 63 is higher, the specimen 11 is held bonded to the thin plate 11. Since the movement, surface cleaning, etc. of the specimen 11 may be performed while held attached to the thin plate 11, the specimen 11 may be thinned to an extreme limit. The smooth thin piece of a silicon surface which may produce unevenness on the surface when chemically polished may be made. It is also possible to readily monitor the thickness (t) of the specimen thin piece 11 during polishing.