JPS55147580A - Adhesive composition - Google Patents

Adhesive composition

Info

Publication number
JPS55147580A
JPS55147580A JP5572079A JP5572079A JPS55147580A JP S55147580 A JPS55147580 A JP S55147580A JP 5572079 A JP5572079 A JP 5572079A JP 5572079 A JP5572079 A JP 5572079A JP S55147580 A JPS55147580 A JP S55147580A
Authority
JP
Japan
Prior art keywords
epoxy compound
melamine
curing agent
epoxy
org
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5572079A
Other languages
Japanese (ja)
Other versions
JPS5734876B2 (en
Inventor
Kunio Kageyama
Shigeo Omote
Yoshiaki Someya
Tetsuo Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama Rubber Co Ltd
Original Assignee
Yokohama Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokohama Rubber Co Ltd filed Critical Yokohama Rubber Co Ltd
Priority to JP5572079A priority Critical patent/JPS55147580A/en
Publication of JPS55147580A publication Critical patent/JPS55147580A/en
Publication of JPS5734876B2 publication Critical patent/JPS5734876B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To provide a structural adhesive composition capable of simplifying an application procedure and excellent in strength, heat resistance and water resistance constituted by compounding an epoxy compound, a polyamide powder, a curing agent comprising melamine and imidazole and an org. solvent.
CONSTITUTION: (a) An epoxy compound having two or more of epoxy group in a molecule such as bisphenol A, (b) a polyamide resin powder with m.p. of 60W 200°C and an average particle size of below 50μ such as AMILAN CM-4,000 (trade name, produced by TOYO RAYON KK), (c) melamine (curing agent), (d) imidazoles (curing agent) such as 2-methylimidazole, and (e) a low b.p. org. solvent dissoving an epoxy compound but not a polyamide powder such as methyl ethyl ketone are compounded. In the above described compounding ratio, to 1pts.wt. epoxy compound (a), a polyamide resin (b) is 0.2W5pts.wt., melamine (c) is 0.01W0.5mol (per epoxy eq.) and imidazole (d) is 0.005W0.1pts.wt.
COPYRIGHT: (C)1980,JPO&Japio
JP5572079A 1979-05-09 1979-05-09 Adhesive composition Granted JPS55147580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5572079A JPS55147580A (en) 1979-05-09 1979-05-09 Adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5572079A JPS55147580A (en) 1979-05-09 1979-05-09 Adhesive composition

Publications (2)

Publication Number Publication Date
JPS55147580A true JPS55147580A (en) 1980-11-17
JPS5734876B2 JPS5734876B2 (en) 1982-07-26

Family

ID=13006698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5572079A Granted JPS55147580A (en) 1979-05-09 1979-05-09 Adhesive composition

Country Status (1)

Country Link
JP (1) JPS55147580A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63132925A (en) * 1986-11-25 1988-06-04 Sumitomo Chem Co Ltd Epoxy group-containing elastomer composition
JPH02286738A (en) * 1989-04-28 1990-11-26 Somar Corp Epoxy resin composition prevented from generating curing strain and method of bonding therewith
JP2012191194A (en) * 2011-02-23 2012-10-04 Mitsubishi Chemicals Corp Photoelectric conversion element, solar cell, solar cell module, and method for manufacturing the same
JP2016505087A (en) * 2013-01-29 2016-02-18 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ Fixing agent composition and primer composition for metal plastic hybrid member
CN106916561A (en) * 2015-12-16 2017-07-04 三键有限公司 Form the resin combination of film
WO2019054392A1 (en) * 2017-09-15 2019-03-21 住友精化株式会社 Epoxy resin composition

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63175969U (en) * 1987-05-01 1988-11-15
JPH0160108U (en) * 1987-10-08 1989-04-17

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63132925A (en) * 1986-11-25 1988-06-04 Sumitomo Chem Co Ltd Epoxy group-containing elastomer composition
JPH02286738A (en) * 1989-04-28 1990-11-26 Somar Corp Epoxy resin composition prevented from generating curing strain and method of bonding therewith
JP2012191194A (en) * 2011-02-23 2012-10-04 Mitsubishi Chemicals Corp Photoelectric conversion element, solar cell, solar cell module, and method for manufacturing the same
JP2016505087A (en) * 2013-01-29 2016-02-18 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ Fixing agent composition and primer composition for metal plastic hybrid member
CN106916561A (en) * 2015-12-16 2017-07-04 三键有限公司 Form the resin combination of film
WO2019054392A1 (en) * 2017-09-15 2019-03-21 住友精化株式会社 Epoxy resin composition
CN111094449A (en) * 2017-09-15 2020-05-01 住友精化株式会社 Epoxy resin composition
JPWO2019054392A1 (en) * 2017-09-15 2020-10-15 住友精化株式会社 Epoxy resin composition

Also Published As

Publication number Publication date
JPS5734876B2 (en) 1982-07-26

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